1-1586037-6 TE Connectivity, 1-1586037-6 Datasheet - Page 5

• Manufacturer Part Number: 1-1586037-6
• Description: PLUG & SOCKET CONN, HEADER, 16POS, 4.2MM
• Manufacturer: TE Connectivity
• Type: Powerr
• Series: VAL-U-LOKr

Specifications of 1-1586037-6

• Gender: HDR
• Body Orientation: Straight
• Housing Material: Nylon
• Number Of Contacts: 16POS
• Number Of Ports: 1Port
• Number Of Terminals: 16
• Current Rating (max): 9/ContactA
• Pitch (mm): 4.2mm
• Contact Material: Brass
• Operating Temp Range: -40C to 105C
• Voltage Rating Max: 600VAC
• Mounting Style: Through Hole
• Termination Method: Solder
• Contact Plating: Tin
• Product Height (mm): 12.8mm
• Pitch Spacing: 4.2mm
• Contact Termination: Through Hole
• No. Of Contacts: 16
• No. Of Rows: 2
• Connector Mounting: PCB
• Rohs Compliant: Yes
• Product Type: Connector
• Connector Type: Header
• Termination Method To Pc Board: Through Hole - Solder
• Pcb Mounting Orientation: Vertical
• Pcb Mount Alignment: Without
• Pcb Mount Retention: Without
• Shrouded: Yes
• Sealed: No
• Ul File Number: E28476
• Csa File Number: 208567
• Mating Retention Type: Latching
• Contact Current Rating, Max (a): 9
• Operating Voltage Reference: AC
• Operating Voltage (vac): 600
• Wire/cable Size (awg): 16 – 26
• Wire/cable Size (mm²): 0.12 – 1.4
• Tail Orientation: In-line
• Tail Length (mm [in]): 3.5 [0.138]
• Profile Height (y-axis) (mm [in]): 12.80 [0.504]
• Header Type: Shrouded
• Number Of Positions: 16
• Number Of Rows: 2
• Centerline (mm [in]): 4.20 [0.165]
• Mating Retention: With
• Selectively Loaded: No
• Length (x-axis) (mm [in]): 34.80 [1.3701]
• Width (z-axis) (mm [in]): 9.80 [0.386]
• Contact Type: Pin
• Contact Base Material: Brass
• Contact Plating, Mating Area, Material: Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 2.54 [100]
• Tail Plating Material: Tin
• Tail Plating, Thickness (µm [?in]): 2.54 [100]
• Contact Design: Square Post
• Connector Style: Plug
• Mating Alignment: With
• Mating Alignment Type: Keyed
• Housing Color: Natural
• Ul Flammability Rating: UL 94V-2
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Agency/standard: UL, CSA
• Ul Rating: Recognized
• Circuit Identification Feature: With
• Operating Temperature (°c [°f]): -40 – +105 [-40 – +221]
• Applies To: Printed Circuit Board
• Pcb Thickness, Recommended (mm [in]): 1.60 [0.063]
• Application Use: Wire-to-Board
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Tray
• Lead Free Status / RoHS Status: Compliant

4.
4.1.
4.2.
4.3.
4.4.
Rev B
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form , fit or function are m ade to the product or m anufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determ ined by developm ent/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product m eets the requirem ents of Figure 1. Failures
attributed to equipm ent, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specim ens resubm itted for qualification. Testing to
confirm corrective action is required before resubm ittal.
Quality Conform ance Inspection
The applicable quality inspection plan shall specify the sam pling acceptable quality level to be used.
Dim ensional and functional requirem ents shall be in accordance with the applicable product drawing
and this specification.
Specim en Selection
Specim ens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Each test group shall consist of a m inim um of 5
specim ens.
Test Sequence
Qualification inspection shall be verified by testing specim ens as specified in Figure 2.
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