794637-2 TE Connectivity, 794637-2 Datasheet - Page 3

• Manufacturer Part Number: 794637-2
• Description: PLUG & SOCKET CONNECTOR, PLUG, 2POS, 3MM
• Manufacturer: TE Connectivity
• Type: Powerr

Specifications of 794637-2

• Gender: HDR
• Body Orientation: Straight
• Housing Material: Nylon
• Number Of Contacts: 2POS
• Number Of Ports: 1Port
• Number Of Terminals: 2
• Current Rating (max): 5/ContactA
• Pitch (mm): 3mm
• Contact Material: Brass
• Operating Temp Range: -40C to 105C
• Voltage Rating Max: 250VAC
• Mounting Style: Surface Mount
• Termination Method: Solder
• Contact Plating: Gold Over Nickel
• Product Height (mm): 9.49mm
• Peak Reflow Compatible (260 C): No
• Body Material: Nylon
• Leaded Process Compatible: No
• Mounting Type: Straight PCB Surface Mount
• Connecting Termination: PC Board
• Connector Type: Plug & Socket
• Rohs Compliant: No
• Product Type: Connector
• Mount Angle: Vertical
• Mount: Printed Circuit Board
• Pcb Mount Alignment: With
• Product Line: Micro MATE-N-LOK
• Boardlock Plating: Tin-Lead
• Smt Holddown Plating: Tin-Lead
• Mating Retention Type: Latching
• Smt Holddown Material: Phosphor Bronze
• Voltage (vac): 250
• Current Rating (a): 5
• Solder Tail Contact Plating: Tin-Lead
• Number Of Positions: 2
• Number Of Rows: 2
• Row-to-row Spacing (mm [in]): 3.00 [0.118]
• Centerline (mm [in]): 3.00 [0.118]
• Pcb Mount Retention Type: SMT Hold Down
• Mating Retention: With
• Contact Type: Pin
• Contact Termination Type: Surface Mount
• Contact Layout: Double-Row
• Contact Plating, Mating Area, Material: Gold (15)
• Contact Base Material: Brass
• Connector Style: Plug
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Not suitable for lead free processing
• Applies To: Printed Circuit Board
• Pcb Thickness, Recommended (mm [in]): 1.57 [0.062]
• Lead Free Status / RoHS Status: Not Compliant

Solderability, dip test.
Crimp tensile.
Vibration, random.
Mechanical shock.
Durability.
Header contact retention.
Crimp contact retention.
Rev D
Test Description
Solderable area shall have a
minimum of 95% solder coverage.
No discontinuities of 1 microsecond
or longer duration.
See Note.
No discontinuities of 1 microsecond
or longer duration.
See Note.
See Note.
Contact shall not dislodge.
See Note.
Contact shall not dislodge.
See Note.
Wire Size
(AWG)
20
22
24
26
28
30
Figure 1 (continued)
MECHANICAL
Requirement
(kg [lb] minimum)
Crimp Tensile
7.95 [17.5]
5.00 [11]
3.60 [7.9]
2.05 [4.5]
1.40 [3.1]
0.77 [1.7]
EIA-364-52,
Category 3 For thru-hole.
EIA-638 for surface mount.
Subject contacts to solderability.
EIA-364-8.
Determine crimp tensile at a
maximum rate of 25 ± 6 mm [.98 ±
.24 in] per minute.
EIA-364-28, Test Condition VII,
Condition D.
Subject mated specimens to 3.10
G's rms between 20-500 Hz. 15
minutes in each of 3 mutually
perpendicular planes.
See Figure 4.
EIA-364-27, Method A.
Subject mated specimens to 50 G's
half-sine shock pulses of 11
milliseconds duration. 3 shocks in
each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 4.
EIA-364-9.
Mate and unmate specimens for 30
cycles for tin plated specimens, 75
cycles for 15 µin gold plated
specimens, and 150 cycles for 30
µin gold plated specimens at a
maximum rate of 500 cycles per
hour.
EIA-364-29.
Apply an axial load of 1.4 kg [3.1 lb]
to contacts at a rate of 0.45 kg [1 lb]
per second and hold for 6 seconds.
EIA-364-29.
Apply an axial load of 1.81 kg [4 lb]
to contacts at a rate of 0.45 kg [1 lb]
per second and hold for 6 seconds.
Procedure
108-1836
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