794637-2 TE Connectivity, 794637-2 Datasheet - Page 5

• Manufacturer Part Number: 794637-2
• Description: PLUG & SOCKET CONNECTOR, PLUG, 2POS, 3MM
• Manufacturer: TE Connectivity
• Type: Powerr

Specifications of 794637-2

• Gender: HDR
• Body Orientation: Straight
• Housing Material: Nylon
• Number Of Contacts: 2POS
• Number Of Ports: 1Port
• Number Of Terminals: 2
• Current Rating (max): 5/ContactA
• Pitch (mm): 3mm
• Contact Material: Brass
• Operating Temp Range: -40C to 105C
• Voltage Rating Max: 250VAC
• Mounting Style: Surface Mount
• Termination Method: Solder
• Contact Plating: Gold Over Nickel
• Product Height (mm): 9.49mm
• Peak Reflow Compatible (260 C): No
• Body Material: Nylon
• Leaded Process Compatible: No
• Mounting Type: Straight PCB Surface Mount
• Connecting Termination: PC Board
• Connector Type: Plug & Socket
• Rohs Compliant: No
• Product Type: Connector
• Mount Angle: Vertical
• Mount: Printed Circuit Board
• Pcb Mount Alignment: With
• Product Line: Micro MATE-N-LOK
• Boardlock Plating: Tin-Lead
• Smt Holddown Plating: Tin-Lead
• Mating Retention Type: Latching
• Smt Holddown Material: Phosphor Bronze
• Voltage (vac): 250
• Current Rating (a): 5
• Solder Tail Contact Plating: Tin-Lead
• Number Of Positions: 2
• Number Of Rows: 2
• Row-to-row Spacing (mm [in]): 3.00 [0.118]
• Centerline (mm [in]): 3.00 [0.118]
• Pcb Mount Retention Type: SMT Hold Down
• Mating Retention: With
• Contact Type: Pin
• Contact Termination Type: Surface Mount
• Contact Layout: Double-Row
• Contact Plating, Mating Area, Material: Gold (15)
• Contact Base Material: Brass
• Connector Style: Plug
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Not suitable for lead free processing
• Applies To: Printed Circuit Board
• Pcb Thickness, Recommended (mm [in]): 1.57 [0.062]
• Lead Free Status / RoHS Status: Not Compliant

3.6.
Rev D
Product Qualification and Requalification Test Sequence
NOTE
(a) See paragraph 4.1.A.
(b) Numbers indicate sequence in which tests are performed.
(c)
(d) The fourth test in this sequence will be either humidity/temperature cycling for tin plated
Initial examination of product
Termination resistance
Insulation resistance
Dielectric withstanding voltage
Temperature rise vs current
Solderability, dip test
Crimp tensile
Vibration, random
Mechanical shock
Durability
Header contact retention
Crimp contact retention
Crimp contact insertion force
Mating force (contacts only)
Unmating force (contacts only)
Housing lock strength
Thermal shock
Humidity/temperature cycling
Temperature life
Mixed flowing gas
Final examination of product
Test omitted when testing wire-to-wire connectors.
specimens or mixed flowing gas for gold plated specimens. Precondition specimens with
10 cycles of durability.
Test or Examination
Figure 2
3,7
1
1
5
6
4
2
8
9
4(d)
4(d)
Test Sequence (b)
2,6
3,7
2
1
5
8
Test Group (a)
10(c)
3,7
4,8
11
12
3
1
2
9
5
6
4
1
2
3
5
1
2
3
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