74LVC16244AEV/G:55 NXP Semiconductors, 74LVC16244AEV/G:55 Datasheet - Page 2

74LVC16244AEV/VFBGA56/TRAYBDP/

74LVC16244AEV/G:55

Manufacturer Part Number
74LVC16244AEV/G:55
Description
74LVC16244AEV/VFBGA56/TRAYBDP/
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet

Specifications of 74LVC16244AEV/G:55

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
4
Number Of Bits Per Element
4
Current - Output High, Low
24mA, 24mA
Voltage - Supply
1.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
56-VFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
74LVC16244AEV/G-S
74LVC16244AEV/G-S
935281135551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74LVC16244AEV/G:55
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
3. Ordering information
Table 1.
4. Functional diagram
74LVC_LVCH16244A_9
Product data sheet
Type number
74LVC16244ADL
74LVCH16244ADL
74LVC16244ADGG
74LVCH16244ADGG
74LVC16244AEV
74LVCH16244AEV
74LVC16244ABQ
74LVCH16244ABQ
Fig 1. Logic symbol
47
46
44
43
41
40
38
37
48
1
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
2A0
1OE
2OE
1A0
1A1
1A2
1A3
2A1
2A2
2A3
Ordering information
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
Temperature range Package
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
11
12
2
3
5
6
8
9
36
35
33
32
25
30
29
27
26
24
3OE
4OE
3A0
3A1
3A2
3A3
4A0
4A1
4A2
4A3
All information provided in this document is subject to legal disclaimers.
Name
SSOP48
TSSOP48
VFBGA56
HXQFN60U plastic thermal enhanced extremely thin quad flat
001aae506
3Y0
3Y1
3Y2
3Y3
4Y0
4Y1
4Y2
4Y3
Rev. 09 — 18 March 2010
74LVC16244A; 74LVCH16244A
19
20
22
23
13
14
16
17
16-bit buffer/line driver; 5 V input/output tolerant; 3-state
plastic shrink small outline package; 48 leads;
Description
body width 7.5 mm
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
plastic very thin fine-pitch ball grid array package;
56 balls; body 4.5 × 7 × 0.65 mm
package; no leads; 60 terminals; UTLP based;
body 4 x 6 x 0.5 mm
Fig 2. IEC logic symbol
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
1OE
2OE
3OE
4OE
1A0
1A1
1A2
1A3
2A0
2A1
2A2
2A3
3A0
3A1
3A2
3A3
4A0
4A1
4A2
4A3
48
25
24
47
46
44
43
41
40
38
37
36
35
33
32
30
29
27
26
1
EN1
EN2
EN3
EN4
1
1
1
1
1
2
3
4
001aae231
11
12
13
14
16
17
19
20
22
23
2
3
5
6
8
9
© NXP B.V. 2010. All rights reserved.
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
3Y0
3Y1
3Y2
3Y3
4Y0
4Y1
4Y2
4Y3
Version
SOT370-1
SOT362-1
SOT702-1
SOT1134-1
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