AD8231ACPZ-RL Analog Devices Inc, AD8231ACPZ-RL Datasheet - Page 7

• Manufacturer Part Number: AD8231ACPZ-RL
• Description: IC,Instrumentation Amplifier,SINGLE,LLCC,16PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of AD8231ACPZ-RL

• Amplifier Type: Instrumentation
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 1.1 V/µs
• Gain Bandwidth Product: 7MHz
• Current - Input Bias: 250pA
• Voltage - Input Offset: 4µV
• Current - Supply: 4mA
• Current - Output / Channel: 70mA
• Voltage - Supply, Single/dual (±): 3 V ~ 6 V, ±1.5 V ~ 3 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-LFCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD8231-EVALZ - BOARD EVAL FOR AD8231
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Output Short-Circuit Current
Input Voltage (Common-Mode)
Differential Input Voltage
Storage Temperature Range
Operational Temperature Range
Package Glass Transition Temperature
ESD (Human Body Model)
ESD (Charged Device Model)
ESD (Machine Model)
1
beyond 1000 hours can impact part reliability.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
For junction temperatures between 105°C and 130°C, short-circuit operation
Rating
6 V
Indefinite
−V
−V
–65°C to +150°C
–40°C to +125°C
130°C
1.5 kV
1.5 kV
0.2 kV
S
S
− 0.3 V to +V
− 0.3 V to +V
1
S
S
+ 0.3 V
+ 0.3 V
Rev. A | Page 7 of 24
THERMAL RESISTANCE
Table 5.
Thermal Pad
Soldered to Board
Not Soldered to Board
The θ values in Table 5
board. If the thermal pad is soldered to the board, it is
also assumed it is connected to a plane. θ
is 6.3°C/W.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8231 is limited
by the associated rise in junction temperature (T
approximately 130°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric perform-
ance of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality.
ESD CAUTION
JA
assume a 4-layer JEDEC standard
JC
at the exposed pad
θ
54
96
JA
J
) on the die. At
AD8231
Unit
°C/W
°C/W