AD9631AR Analog Devices Inc, AD9631AR Datasheet - Page 3

• Manufacturer Part Number: AD9631AR
• Description: Operational Amplifier (Op-Amp) IC
• Manufacturer: Analog Devices Inc

Specifications of AD9631AR

• Number Of Amplifiers: 1
• Bandwidth Max: 320MHz
• Slew Rate: 1300V/us
• Package/case: 8-SOIC
• Amplifier Type: Bias Current
• Leaded Process Compatible: No
• Offset Voltage: 3mV
• Rohs Status: RoHS non-compliant
• Number Of Circuits: 1
• -3db Bandwidth: 320MHz
• Current - Input Bias: 2µA
• Voltage - Input Offset: 3000µV
• Current - Supply: 17mA
• Current - Output / Channel: 70mA
• Voltage - Supply, Single/dual (±): 6 V ~ 12 V, ±3 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Output Type: -
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ABSOLUTE MAXIMUM RATINGS
Supply Voltage (+V
Voltage Swing ¥ Bandwidth Product . . . . . . . . . . . 550 V-MHz
Internal Power Dissipation
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ± 1.2 V
Output Short Circuit Duration
Storage Temperature Range N, R . . . . . . . . . –65 C to +125 C
Operating Temperature Range (A Grade) . . . . –40 C to +85 C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300 C
NOTES
1
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD9631/AD9632 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REV. C
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Specification is for device in free air:
8-Lead PDIP Package: q
8-Lead SOIC Package: q
. . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Plastic Package (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . . 0.9 W
(1.17)
0.046
0.046
(1.17)
Dimensions shown in inches and (millimeters)
METALLIZATION PHOTO
+IN
–IN
–IN
+IN
3
2
2
3
S
JA
JA
to –V
Connect Substrate to –V
= 90∞C/W
= 140∞C/W
–V
–V
4
4
S
S
2
S
) . . . . . . . . . . . . . . . . . . . . . 12.6 V
0.050 (1.27)
1
AD9631
AD9632
S
+V
+V
7
7
S
S
6
OUT
6
OUT
S
–3–
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by these
devices is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150 C. Exceeding this limit temporarily
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a junc-
tion temperature of 175 C for an extended period can result in
device failure.
While the AD9631 and AD9632 are internally short circuit
protected, this may not be sufficient to guarantee that the maxi-
mum junction temperature (150 C) is not exceeded under all
conditions. To ensure proper operation, it is necessary to observe
the maximum power derating curves.
Model
AD9631AN
AD9631AR
AD9631AR-REEL
AD9631AR-REEL7 –40∞C to +85∞C SOIC
AD9631CHIPS
AD9632AN
AD9632AR
AD9632AR-REEL
AD9632AR-REEL7 –40∞C to +85∞C SOIC
2.0
1.5
1.0
0.5
0
–50
Figure 2. Maximum Power Dissipation
vs. Temperature
–40 –30 –20 –10
ORDERING GUIDE
8-LEAD SOIC PACKAGE
Temperature
Range
–40∞C to +85∞C PDIP
–40∞C to +85∞C SOIC
–40∞C to +85∞C SOIC
–40∞C to +85∞C PDIP
–40∞C to +85∞C SOIC
–40∞C to +85∞C SOIC
AMBIENT TEMPERATURE – C
0
8-LEAD PDIP PACKAGE
10 20 30
AD9631/AD9632
Package
Description Option
Die
40 50
60 70
T
J
= +150 C
80 90
Package
N-8
R-8
R-8
R-8
N-8
R-8
R-8
R-8