AD9739-MIX-EBZ Analog Devices Inc, AD9739-MIX-EBZ Datasheet - Page 53
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AD9739-MIX-EBZ
Manufacturer Part Number
AD9739-MIX-EBZ
Description
14 Bit 2.5 GSPS DAC
Manufacturer
Analog Devices Inc
Datasheet
1.AD9739BBCZ.pdf
(56 pages)
Specifications of AD9739-MIX-EBZ
Number Of Dac's
1
Number Of Bits
14
Outputs And Type
1, Differential
Sampling Rate (per Second)
2.5G
Data Interface
SPI™
Dac Type
Current
Voltage Supply Source
Analog and Digital
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
AD9739
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9739BBCZ
AD9739BBCZRL
AD9739BBC
AD9739BBCRL
AD9739-EBZ
AD9739-MIX-EBZ
AD9739-CMTS-EBZ
1
Z = RoHs Compliant Part.
1
1
1
1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
1.40 MAX
Figure 111. 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
BALL A1
INDICATOR
TOP VIEW
12.10
12.00 SQ
11.90
COMPLIANT TO JEDEC STANDARDS MO-205-AE.
160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board for Normal Mode Evaluation
Evaluation Board for Mix Mode Evaluation
Evaluation Board for CMTS Evaluation
Package Description
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Dimensions shown in millimeters
0.43 MAX
0.25 MIN
Rev. 0 | Page 53 of 56
(BC-160-1)
BSC SQ
10.40
REF
0.80
BALL DIAMETER
0.55
0.50
0.45
14
13
DETAIL A
12
11
10
BOTTOM
0.80 BSC
9
VIEW
8
SEATING
PLANE
7
INDEX AREA
A1 CORNER
6
5
4
3
2
1
1.00 MAX
0.85 MIN
0.12 MAX
COPLANARITY
B
D
E
H
K
L
M
N
P
A
C
F
G
J
Package Option
BC-160-1
BC-160-1
BC-160-1
BC-160-1
AD9739