ADA4856-3YCPZ-R7 Analog Devices Inc, ADA4856-3YCPZ-R7 Datasheet - Page 5

• Manufacturer Part Number: ADA4856-3YCPZ-R7
• Description: Triple High Speed Extend Input Range RR
• Manufacturer: Analog Devices Inc

Specifications of ADA4856-3YCPZ-R7

• Applications: Voltage Feedback
• Output Type: Rail-to-Rail
• Number Of Circuits: 3
• -3db Bandwidth: 370MHz
• Slew Rate: 800 V/µs
• Current - Supply: 7.8mA
• Current - Output / Channel: 52mA
• Voltage - Supply, Single/dual (±): 3 V ~ 5.5 V, ±1.5 V ~ 2.75 V
• Mounting Type: Surface Mount
• Package / Case: 16-VQFN, CSP Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADA4856-3YCPZ-R7TR

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Internal Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
for a device soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
16-Lead LFCSP
Specification is for device in free air.
JA
is specified for the worst-case conditions, that is, θ
1
θ
67
JA
Rating
6 V
See Figure 3
(−V
±V
Observe power curves
−65°C to +125°C
−40°C to +105°C
300°C
S
θ
17.5
S
− 0.2 V) to (+V
JC
JA
is specified
Unit
°C/W
S
− 1 V)
Rev. A | Page 5 of 20
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
ADA4856-3 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass transition
temperature of the plastic, approximately 150°C. Temporarily
exceeding this limit may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
ESD CAUTION
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0
AMBIENT TEMPERATURE (°C)
ADA4856-3