ADG1236YCPZ-500RL7 Analog Devices Inc, ADG1236YCPZ-500RL7 Datasheet - Page 14

• Manufacturer Part Number: ADG1236YCPZ-500RL7
• Description: IC,ANALOG SWITCH,DUAL,SPDT,CMOS,LLCC,12PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: iCMOS®r
• Type: Analog Switchr

Specifications of ADG1236YCPZ-500RL7

• Function: Switch
• Circuit: 2 x SPDT
• On-state Resistance: 260 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 12V, 15V
• Current - Supply: 1µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 12-VFQFN, CSP Exposed Pad
• Multiplexer Configuration: Dual SPDT
• Number Of Inputs: 2
• Number Of Outputs: 4
• Number Of Channels: 2
• Analog Switch On Resistance: 475@10.8VOhm
• Analog Switch Turn On Time: 150ns
• Analog Switch Turn Off Time: 190ns
• Package Type: LFCSP
• Power Supply Requirement: Single/Dual
• Single Supply Voltage (typ): 12V
• Dual Supply Voltage (typ): ±15V
• Power Dissipation: 3.5mW
• Supply Current: 0.23mA
• Mounting: Surface Mount
• Pin Count: 12
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADG1236YCPZ-500RL7TR

ADG1236
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1236YRUZ
ADG1236YRUZ-REEL
ADG1236YRUZ-REEL7
ADG1236YCPZ-500RL7
ADG1236YCPZ-REEL7
1
Z = Pb-free part.
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
INDICATOR
SEATING
PLANE
1.00
0.85
0.80
PIN 1
0.15
0.05
12 MAX
4.50
4.40
4.30
PIN 1
Figure 31. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 30. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
BSC SQ
16
VIEW
0.30
0.23
0.18
TOP
1
3.00
COPLANARITY
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-153AB
* COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
EXCEPT FOR EXPOSED PAD DIMENSION.
5.10
5.00
4.90
0.10
3 mm × 3 mm Body, Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
BSC SQ
0.20 REF
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
2.75
9
8
Rev. 0 | Page 14 of 16
1.20
MAX
0.05 MAX
0.02 NOM
SEATING
PLANE
BSC
6.40
(BOTTOM VIEW)
EXPOSED PAD
(CP-12-1)
(RU-16)
0.45
0.20
0.09
COPLANARITY
0.60 MAX
BSC
0.50
0.08
8°
0°
9
8
7
10
6
11
5
12
4
1
2
3
0.75
0.55
0.35
* 1.45
0.25 MIN
0.75
0.60
0.45
1.30 SQ
1.15
PIN 1
INDICATOR
Package Option
RU-16
RU-16
RU-16
CP-12-1
CP-12-1