ADG1404YRUZ Analog Devices Inc, ADG1404YRUZ Datasheet - Page 16

• Manufacturer Part Number: ADG1404YRUZ
• Description: +/-15V 4:1 Mux With Ron Max = 2 Ohm
• Manufacturer: Analog Devices Inc
• Series: iCMOS®r

Specifications of ADG1404YRUZ

• Function: Multiplexer
• Circuit: 1 x 4:1
• On-state Resistance: 1.8 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 12V, 15V
• Current - Supply: 1µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADG1404
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1404YRUZ
ADG1404YRUZ-REEL7
ADG1404YCPZ-REEL
ADG1404YCPZ-REEL7
1
©2008–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
INDICATOR
COPLANARITY
SEATING
PLANE
1.05
1.00
0.80
1.00
0.85
0.80
PIN 1
PIN 1
4.50
4.40
4.30
0.10
0.15
0.05
12° MAX
D06841-0-3/09(A)
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 33. 14-Lead Thin Shrink Small Outline Package [TSSOP]
14
1
0.65 BSC
TOP VIEW
BSC SQ
0.30
0.23
0.18
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
4.00
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.
5.10
5.00
4.90
4 mm × 4 mm Body, Very Thin Quad
Package Description
14-Lead Thin Shrink Small Outline Package (TSSOP)
14-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Dimensions shown in millimeters
Dimension shown in millimeters
8
7
BSC SQ
0.20 REF
3.75
6.40
BSC
Rev. A | Page 16 of 16
0.80 MAX
0.65 TYP
SEATING
PLANE
0.05 MAX
0.02 NOM
1.20
MAX
(CP-16-13)
(RU-14)
BSC
0.65
COPLANARITY
0.20
0.09
1.95 BCS
0.60 MAX
0.08
12
9
BOT TOM VIEW
13
8
EXPOSED
8°
0°
PAD
16
5
4
0.50
0.40
0.30
1
2.65
2.50 SQ
2.35
0.25 MIN
0.75
0.60
0.45
Package Option
RU-14
RU-14
CP-16-13
CP-16-13