ADSP-21060LKSZ-160 Analog Devices Inc, ADSP-21060LKSZ-160 Datasheet - Page 60

IC,DSP,32-BIT,CMOS,QFP,240PIN,PLASTIC

ADSP-21060LKSZ-160

Manufacturer Part Number
ADSP-21060LKSZ-160
Description
IC,DSP,32-BIT,CMOS,QFP,240PIN,PLASTIC
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Floating Pointr

Specifications of ADSP-21060LKSZ-160

Interface
Host Interface, Link Port, Serial Port
Clock Rate
40MHz
Non-volatile Memory
External
On-chip Ram
512kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
240-MQFP, 240-PQFP
Device Core Size
32b
Architecture
Super Harvard
Format
Floating Point
Clock Freq (max)
40MHz
Mips
40
Device Input Clock Speed
40MHz
Ram Size
512KB
Program Memory Size
Not RequiredKB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3.15V
Operating Supply Voltage (max)
3.45V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
240
Package Type
MQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-21060LKSZ-160
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
SURFACE-MOUNT DESIGN
Table 43
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 43. BGA Data for Use with Surface-Mount Design
Package
225-Ball Grid Array (PBGA)
2.05
65.90
BSC
0.50
is provided as an aide to PCB design. For industry-
3.42
3.17
2.92
121
180
120
181
SEAL RING
75.00 BSC SQ
75.50 BSC SQ
SIDE VIEW
TOP VIEW
29.50 BSC
Figure 45. 240-Lead Ceramic Quad Flat Package, Mounted with Cavity Up [CQFP]
LID
Ball Attach Type
Solder Mask Defined
61
240
60
1
INDEX 1
GOLD
PLATED
Rev. F | Page 60 of 64 | March 2008
Dimensions shown in millimeters
0.90
0.80
0.70
(QS-240-1B)
29.50
BSC
1.22 (4×)
2.60
2.55
2.50
3.60
3.55
3.50
Solder Mask Opening
0.63 mm diameter
NO GOLD
2.00 DIA
INDEX 2
NONCONDUCTIVE
CERAMIC TIE BAR
60
1
240
61
BOTTOM VIEW
70.00 BSC SQ
HEAT SLUG
Ball Pad Size
0.76 mm diameter
181
120
180
121
16.50 (8×)

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