ADSP-21261SKBCZ150 Analog Devices Inc, ADSP-21261SKBCZ150 Datasheet - Page 3

• Manufacturer Part Number: ADSP-21261SKBCZ150
• Description: 150 MHz, 32Bit DSP Processor
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-21261SKBCZ150

• Interface: DAI, SPI
• Clock Rate: 150MHz
• Non-volatile Memory: ROM (384 kB)
• On-chip Ram: 128kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 136-CSPBGA
• Device Core Size: 32/40Bit
• Architecture: Super Harvard
• Format: Floating Point
• Clock Freq (max): 150MHz
• Mips: 150
• Device Input Clock Speed: 150MHz
• Ram Size: 128KB
• Program Memory Size: 384KB
• Operating Supply Voltage (typ): 1.2/3.3V
• Operating Supply Voltage (min): 1.14/3.13V
• Operating Supply Voltage (max): 1.26/3.47V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 136
• Package Type: CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TABLE OF CONTENTS
General Description ................................................. 4
Pin Function Descriptions ........................................ 11
ADSP-21261 Specifications ....................................... 15
ADSP-21261 Family Core Architecture ...................... 4
ADSP-21261 Memory and I/O Interface Features ......... 6
Target Board JTAG Emulator Connector .................... 8
Development Tools ............................................... 8
Evaluation Kit ..................................................... 10
Designing an Emulator-Compatible
Additional Information ......................................... 10
Address Data Pins as Flags ..................................... 14
Boot Modes ........................................................ 14
Core Instruction Rate to CLKIN Ratio Modes ............. 14
Address Data Modes ............................................. 14
Recommended Operating Conditions ....................... 15
Electrical Characteristics ........................................ 15
Absolute Maximum Ratings ................................... 16
ESD Sensitivity .................................................... 16
Timing Specifications ........................................... 17
SIMD Computational Engine ............................... 4
Independent, Parallel Computation Units ................ 4
Data Register File ............................................... 5
Single-Cycle Fetch of Instruction and
Instruction Cache .............................................. 5
Data Address Generators with Zero-Overhead
Flexible Instruction Set ....................................... 6
Dual-Ported On-Chip Memory ............................. 6
DMA Controller ................................................ 6
Digital Applications Interface (DAI) ....................... 6
Serial Ports ....................................................... 6
Serial Peripheral (Compatible) Interface .................. 7
Parallel Port ..................................................... 7
Timers ............................................................ 8
Program Booting ............................................... 8
Phase-Locked Loop ............................................ 8
Power Supplies .................................................. 8
DSP Board (Target) ........................................... 10
Power-Up Sequencing ....................................... 18
Clock Input ..................................................... 19
Clock Signals ................................................... 19
Four Operands ............................................... 5
Hardware Circular Buffer Support ...................... 5
Rev. 0 | Page 3 of 44 | March 2006
136-Ball BGA Pin Configurations ............................... 39
144-Lead LQFP Pin Configurations ............................ 42
Package Dimensions ............................................... 43
Ordering Guide ..................................................... 44
REVISION HISTORY
3/06—Rev. 0: Initial Release
Output Drive Currents ......................................... 37
Test Conditions .................................................. 37
Capacitive Loading .............................................. 37
Environmental Conditions .................................... 38
Thermal Characteristics ........................................ 38
Surface Mount Design .......................................... 44
Reset ............................................................. 20
Interrupts ....................................................... 20
Core Timer ..................................................... 20
Timer PWM_OUT Cycle Timing ......................... 21
Timer WDTH_CAP Timing ............................... 21
DAI Pin-to-Pin Direct Routing ............................ 22
Precision Clock Generator (Direct Pin Routing) ...... 23
Flags ............................................................. 24
Memory Read—Parallel Port ............................... 25
Memory Write—Parallel Port ............................. 27
Serial Ports ..................................................... 29
Input Data Port (IDP) ....................................... 32
Parallel Data Acquisition Port (PDAP) .................. 33
SPI Protocol—Master ........................................ 34
SPI Protocol—Slave .......................................... 34
JTAG Test Access Port and Emulation .................. 36
ADSP-21261