AM29LV641DH120REI Spansion Inc., AM29LV641DH120REI Datasheet - Page 5

• Manufacturer Part Number: AM29LV641DH120REI
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of AM29LV641DH120REI

• Memory Configuration: 4M X 16
• Ic Interface Type: Parallel
• Access Time: 120ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Mounting Type: Surface Mount
• Peak Reflow Compatible (260 C): No
• Supply Voltage: 3V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10
Common Flash Memory Interface (CFI) . . . . . . . 21
Command Definitions . . . . . . . . . . . . . . . . . . . . . 23
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 29
January 22, 2007 22366C6
Special Handling Instructions for FBGA/fBGA Packages ......... 7
VersatileIO™ (V
Requirements for Reading Array Data ................................... 10
Writing Commands/Command Sequences ............................ 11
Standby Mode ........................................................................ 11
Automatic Sleep Mode ........................................................... 11
RESET#: Hardware Reset Pin ............................................... 11
Output Disable Mode .............................................................. 12
Autoselect Mode ..................................................................... 16
Sector Group Protection and Unprotection ............................. 17
Write Protect (WP#) ................................................................ 18
Temporary Sector Group Unprotect ....................................... 18
SecSi (Secured Silicon) Sector Flash Memory Region .......... 20
Hardware Data Protection ...................................................... 20
Reading Array Data ................................................................ 23
Reset Command ..................................................................... 24
Autoselect Command Sequence ............................................ 24
Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 24
Word Program Command Sequence ..................................... 24
Chip Erase Command Sequence ........................................... 25
Sector Erase Command Sequence ........................................ 26
Erase Suspend/Erase Resume Commands ........................... 26
Command Definitions ............................................................. 28
DQ7: Data# Polling ................................................................. 29
Table 1. Device Bus Operations .....................................................10
Accelerated Program Operation ......................................................11
Autoselect Functions .......................................................................11
Table 2. Sector Address Table ........................................................12
Table 3. Autoselect Codes, (High Voltage Method) .......................16
Table 4. Sector Group Protection/Unprotection Address Table .....17
Figure 1. Temporary Sector Group Unprotect Operation................ 18
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 19
Table 5. SecSi Sector Contents ......................................................20
Low VCC Write Inhibit .....................................................................20
Write Pulse “Glitch” Protection ........................................................21
Logical Inhibit ..................................................................................21
Power-Up Write Inhibit ....................................................................21
Table 6. CFI Query Identification String .......................................... 21
System Interface String................................................................... 22
Table 8. Device Geometry Definition .............................................. 22
Table 9. Primary Vendor-Specific Extended Query ........................ 23
Unlock Bypass Command Sequence ..............................................25
Figure 3. Program Operation .......................................................... 25
Figure 4. Erase Operation............................................................... 27
Command Definitions...................................................................... 28
Figure 5. Data# Polling Algorithm ................................................... 29
IO
) Control ..................................................... 10
Am29LV640D/Am29LV641D
D A T A
S H E E T
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 33
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Key to Switching Waveforms. . . . . . . . . . . . . . . . 36
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37
Erase And Programming Performance . . . . . . . 48
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 48
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 48
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 49
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53
RY/BY#: Ready/Busy# ............................................................ 30
DQ6: Toggle Bit I .................................................................... 30
DQ2: Toggle Bit II ................................................................... 31
Reading Toggle Bits DQ6/DQ2 ............................................... 31
DQ5: Exceeded Timing Limits ................................................ 31
DQ3: Sector Erase Timer ....................................................... 31
Read-Only Operations ........................................................... 37
Hardware Reset (RESET#) .................................................... 38
Erase and Program Operations .............................................. 39
Temporary Sector Unprotect .................................................. 44
Alternate CE# Controlled Erase and Program Operations ..... 46
SSO056—56-Pin Shrink Small Outline Package (SSOP) ...... 49
FBE063—63-Ball Fine-Pitch Ball Grid Array
(FBGA) 12 x 11 mm package ................................................. 50
LAA064—64-Ball Fortified Ball Grid Array
(FBGA) 13 x 11 mm package ................................................. 51
TS 048—48-Pin Standard TSOP ............................................ 52
Figure 6. Toggle Bit Algorithm........................................................ 30
Table 11. Write Operation Status ................................................... 32
Figure 7. Maximum Negative Overshoot Waveform ..................... 33
Figure 8. Maximum Positive Overshoot Waveform....................... 33
Figure 9. I
Active and Automatic Sleep Currents) ........................................... 35
Figure 10. Typical I
Figure 11. Test Setup.................................................................... 36
Table 12. Test Specifications ......................................................... 36
Figure 12. Input Waveforms and
Measurement Levels...................................................................... 36
Figure 13. Read Operation Timings ............................................... 37
Figure 14. Reset Timings ............................................................... 38
Figure 15. Program Operation Timings.......................................... 40
Figure 16. Accelerated Program Timing Diagram.......................... 40
Figure 17. Chip/Sector Erase Operation Timings .......................... 41
Figure 18. Data# Polling Timings
(During Embedded Algorithms)...................................................... 42
Figure 19. Toggle Bit Timings
(During Embedded Algorithms)...................................................... 43
Figure 20. DQ2 vs. DQ6................................................................. 43
Figure 21. Temporary Sector Group Unprotect Timing Diagram ... 44
Figure 22. Sector Group Protect and Unprotect Timing Diagram .. 45
Figure 23. Alternate CE# Controlled Write
(Erase/Program) Operation Timings .............................................. 47
CC1
Current vs. Time (Showing
CC1
vs. Frequency ............................................ 35
3