AM29LV800BT-120EC AMD (ADVANCED MICRO DEVICES), AM29LV800BT-120EC Datasheet
AM29LV800BT-120EC
Specifications of AM29LV800BT-120EC
Related parts for AM29LV800BT-120EC
AM29LV800BT-120EC Summary of contents
Page 1
Data Sheet This product has been retired and is not recommended for designs. For new and current designs, S29AL008D supersedes Am29LV800B and is the factory-recommended migration path. Please refer to the S29AL008D datasheet for specifications and ordering information. Availability of ...
Page 2
THIS PAGE LEFT INTENTIONALLY BLANK. ...
Page 3
... Writing Commands/Command Sequences .......... 11 Program and Erase Operation Status .................. 12 Standby Mode ...................................................... 12 Automatic Sleep Mode ......................................... 12 RESET#: Hardware Reset Pin ............................. 12 Output Disable Mode ............................................ 12 Table 2. Am29LV800BT Top Boot Block Sector Addresses ........................................................13 Table 3. Am29LV800BB Bottom Boot Block Sector Addresses ........................................................13 Autoselect Mode ................................................... 14 Table 4. Am29LV800B Autoselect Codes (High Voltage Method) ................................................14 Sector Protection/Unprotection ...
Page 4
6/1/ ...
Page 5
Am29LV800B 8 Megabit ( 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory For new designs, S29AL008D supersedes Am29LV800B and is the factory-recommended migration path for this device. Please refer to the S29AL008D Family Datasheet for ...
Page 6
GENERAL DESCRIPTION The Am29LV800B Mbit, 3.0 volt-only Flash memory organized as 1,048,576 bytes or 524,288 words. The device is offered in 48-ball FBGA, 44-pin SO, and 48-pin TSOP packages. The device is also available in Known Good ...
Page 7
... Writing Commands/Command Sequences .......... 11 Program and Erase Operation Status .................. 12 Standby Mode ...................................................... 12 Automatic Sleep Mode ......................................... 12 RESET#: Hardware Reset Pin ............................. 12 Output Disable Mode ............................................ 12 Table 2. Am29LV800BT Top Boot Block Sector Addresses ........................................................13 Table 3. Am29LV800BB Bottom Boot Block Sector Addresses ........................................................13 Autoselect Mode ................................................... 14 Table 4. Am29LV800B Autoselect Codes (High Voltage Method) ................................................14 Sector Protection/Unprotection ...
Page 8
PRODUCT SELECTOR GUIDE Family Part Number Speed Options Full Voltage Range: V Max access time ACC Max CE# access time Max OE# access time See “AC Characteristics” for full ...
Page 9
CONNECTION DIAGRAMS This device is also available in Known Good Die (KGD) form. Refer to publication number 21536 for more information. A15 1 A14 2 A13 3 A12 4 A11 5 A10 ...
Page 10
CONNECTION DIAGRAMS This device is also available in Known Good Die (KGD) form. Refer to publication number 21536 for more information. RY/BY# A18 A17 CE OE# ...
Page 11
Special Handling Instructions for FBGA Package Special handling is required for Flash Memory prod- ucts in FBGA packages. PIN CONFIGURATION A0–A18 = 19 addresses DQ0–DQ14= 15 data inputs/outputs DQ15/A-1 = DQ15 (data input/output, word mode), A-1 (LSB address input, byte ...
Page 12
... B = Bottom sector Valid Combinations for FBGA Packages Order Number AM29LV800BT-70, AM29LV800BB-70 AM29LV800BT-90, AM29LV800BB-90 AM29LV800BT-120, AM29LV800BB-120 Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations ...
Page 13
DEVICE BUS OPERATIONS This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command reg- ister itself does not occupy any addressable memory location. The register is composed of ...
Page 14
The device features an Unlock Bypass mode to facil- itate faster programming. Once the device enters the Unlock Bypass mode, only two write cycles are required to program a word or byte, instead of four. The “Word/Byte Program Command Sequence” ...
Page 15
... When the OE# input output from the device IH is disabled. The output pins are placed in the high impedance state. Table 2. Am29LV800BT Top Boot Block Sector Addresses Sector A18 A17 A16 A15 SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 ...
Page 16
Autoselect Mode The autoselect mode provides manufacturer and device identification, and sector protection verifica- tion, through identifier codes output on DQ7–DQ0. This mode is primarily intended for programming equipment to automatically match a device to be pro- grammed with its ...
Page 17
START RESET (Note 1) Perform Erase or Program Operations RESET Temporary Sector Unprotect Completed (Note 2) Notes: 1. All protected sectors unprotected. 2. All previously protected sectors are protected once again. Figure 1. Temporary ...
Page 18
START PLSCNT = 1 RESET Wait First Write Temporary Sector Cycle = 60h? Unprotect Mode Yes Set up sector address Sector Protect: Write 60h to sector address with ...
Page 19
Hardware Data Protection The command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to Table 1 for command definitions). In addition, the following hardware data protection measures prevent acci- dental erasure or ...
Page 20
The device then enters the autoselect mode, and the system may read at any address any number of times, without initiating another command sequence. A read cycle at address XX00h retrieves the manufac- turer code. A read cycle at ...
Page 21
Chip Erase Command Sequence Chip erase is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip ...
Page 22
See “Write Operation Status” for informa- tion on these status bits. After an erase-suspended program operation is com- plete, the system can once again read array data within ...
Page 23
Table 1. Am29LV800B Command Definitions Command Sequence (Note 1) Read (Note 6) 1 Reset (Note 7) 1 Word Manufacturer ID 4 Byte Word Device ID, 4 Top Boot Block Byte Word Device ID, 4 Bottom Boot Block Byte Word Sector ...
Page 24
WRITE OPERATION STATUS The device provides several bits to determine the status of a write operation: DQ2, DQ3, DQ5, DQ6, DQ7, and RY/BY#. Table 2 and the following subsec- tions describe the functions of these bits. DQ7, RY/BY#, and DQ6 ...
Page 25
If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.) If the output is high (Ready), the device is ready to read array data (including during the Erase Suspend ...
Page 26
START Read DQ7–DQ0 (Note Read DQ7–DQ0 Toggle Bit = Toggle? Yes No DQ5 = 1? Yes Read DQ7–DQ0 Twice (Notes 1, 2) Toggle Bit = Toggle? Yes Program/Erase Operation Not Complete, Write Operation Complete Reset Command Notes: 1. Read toggle ...
Page 27
Operation Embedded Program Algorithm Standard Mode Embedded Erase Algorithm Reading within Erase Suspended Sector Erase Suspend Reading within Non-Erase Mode Suspended Sector Erase-Suspend-Program Notes: 1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the ...
Page 28
ABSOLUTE MAXIMUM RATINGS Storage Temperature Plastic Packages . . . . . . . . . . . . . .–65°C to +150°C Ambient Temperature with Power Applied . . . . . . . . . . . .–65°C ...
Page 29
DC CHARACTERISTICS CMOS Compatible Parameter Description I Input Load Current Input Load Current LIT I Output Leakage Current LO V Active Read Current CC I CC1 (Notes Active Write Current CC I CC2 (Notes ...
Page 30
DC CHARACTERISTICS (Continued) Zero Power Flash 500 1000 Addresses are switching at 1 MHz Note: Figure 9. I Current vs. Time (Showing Active and Automatic Sleep Currents) CC1 ...
Page 31
TEST CONDITIONS Device Under Test C L 6.2 kΩ Diodes are IN3064 or equivalent Note: Figure 11. Test Setup KEY TO SWITCHING WAVEFORMS WAVEFORM Don’t Care, Any Change Permitted 3.0 V Input 1.5 V 0.0 V Table 3. Test Specifications ...
Page 32
AC CHARACTERISTICS Read Operations Parameter JEDEC Std t t Read Cycle Time (Note 1) AVAV Address to Output Delay AVQV ACC t t Chip Enable to Output Delay ELQV Output Enable to Output Delay ...
Page 33
AC CHARACTERISTICS Hardware Reset (RESET#) Parameter JEDEC Std Description RESET# Pin Low (During Embedded t READY Algorithms) to Read or Write (See Note) RESET# Pin Low (NOT During Embedded t READY Algorithms) to Read or Write (See Note) t RESET# ...
Page 34
AC CHARACTERISTICS Word/Byte Configuration (BYTE#) Parameter JEDEC Std t t CE# to BYTE# Switching Low or High ELFL/ ELFH t BYTE# Switching Low to Output HIGH Z FLQZ t BYTE# Switching High to Output Active FHQV CE# OE# BYTE# BYTE# ...
Page 35
AC CHARACTERISTICS Erase/Program Operations Parameter JEDEC Std t t Write Cycle Time (Note 1) AVAV Address Setup Time AVWL Address Hold Time WLAX Data Setup Time DVWH Data ...
Page 36
AC CHARACTERISTICS Program Command Sequence (last two cycles Addresses 555h CE Data RY/BY VCS Notes program address program data Illustration shows device ...
Page 37
AC CHARACTERISTICS Erase Command Sequence (last two cycles Addresses 2AAh CE Data 55h RY/BY Notes sector address (for Sector Erase Valid ...
Page 38
AC CHARACTERISTICS t RC dresses VA t ACC OE# t OEH WE# DQ7 Q0–DQ6 t BUS RY/BY Valid address. Illustration shows first status cycle after command sequence, last status read cycle, ...
Page 39
AC CHARACTERISTICS Enter Erase Embedded Suspend Erasing Erase Erase Suspend WE# DQ6 DQ2 The system may use CE# or OE# to toggle DQ2 and DQ6. DQ2 toggles only when read at an address within an Note: erase-suspended sector. Temporary Sector ...
Page 40
AC CHARACTERISTICS RESET# SA, A6, A1, A0 Sector Protect/Unprotect Data 60h 1 μs CE# WE# OE# * For sector protect For sector unprotect ...
Page 41
AC CHARACTERISTICS Alternate CE# Controlled Erase/Program Operations Parameter JEDEC Std t t Write Cycle Time (Note 1) AVAV Address Setup Time AVEL Address Hold Time ELAX Data Setup Time DVEH DS ...
Page 42
AC CHARACTERISTICS 555 for program 2AA for erase Addresses WE# OE# CE Data t R RESET# RY/BY# Notes program address program data, DQ7# = complement of the data written ...
Page 43
ERASE AND PROGRAMMING PERFORMANCE Parameter Sector Erase Time Chip Erase Time Byte Programming Time Word Programming Time Byte Mode Chip Programming Time (Note 3) Word Mode Notes: 1. Typical program and erase times assume the following conditions: 25 programming typicals ...
Page 44
PHYSICAL DIMENSIONS* TS 048—48-Pin Standard TSOP * For reference only. BSC is an ANSI standard for Basic Space Centering. 42 Dwg rev AA; 10/99 Am29LV800B ...
Page 45
PHYSICAL DIMENSIONS TSR048—48-Pin Reverse TSOP * For reference only. BSC is an ANSI standard for Basic Space Centering. Am29LV800B Dwg rev AA; 10/99 43 ...
Page 46
PHYSICAL DIMENSIONS FBB 048—48-Ball Fine-Pitch Ball Grid Array (FBGA Am29LV800B Dwg rev AF; 10/99 ...
Page 47
PHYSICAL DIMENSIONS SO 044—44-Pin Small Outline Package 45 Am29LV800B Dwg rev AC; 10/99 ...
Page 48
REVISION SUMMARY Revision E (January 1998) Distinctive Characteristics Changed typical read and program/erase current specifications. Device now has a guaranteed minimum endurance of 1,000,000 write cycles. In-System Sector Protect/Unprotect Algorithm Figure Corrected Changed wait specification to 150 ...
Page 49
AC Characteristics—Figure 17. Program Operations Timing and Figure 18. Chip/Sector Erase Operations Deleted t and changed OE# waveform to start at GHWL high. Physical Dimensions Replaced figures with more detailed illustrations. Revision G+1 (July 7, 2000) Ordering Information Inserted dashes ...