ATS667LSGTN-T Allegro Microsystems Inc, ATS667LSGTN-T Datasheet - Page 12

• Manufacturer Part Number: ATS667LSGTN-T
• Description: 3-WIRE TRUE 0-SPEED HI ACCURACY GTS
• Manufacturer: Allegro Microsystems Inc
• Type: Special Purposer

Specifications of ATS667LSGTN-T

• Sensing Range: 70% of Air Gap Trip, 30% of Air Gap Release
• Voltage - Supply: 4 V ~ 24 V
• Current - Supply: 12mA
• Current - Output (max): 25mA
• Output Type: Digital, Open Collector
• Features: Gear Tooth Type
• Operating Temperature: -40°C ~ 150°C
• Package / Case: 4-SIP
• Operating Supply Voltage (min): 4V
• Operating Supply Voltage (typ): 5/9/12/15/18V
• Operating Supply Voltage (max): 24V
• Output Current: 20mA
• Package Type: SIP Module(SG)
• Pin Count: 4
• Mounting: Through Hole
• Operating Temp Range: -40C to 150C
• Operating Temperature Classification: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 620-1328-2

ATS667LSG
The device must be operated below the maximum junction
temperature of the device, T
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating T
Allegro website.)
The Package Thermal Resistance, R
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, R
small component of R
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, P
be estimated. The following formulas represent the fundamental
relationships used to estimate T

For example, given common conditions such as: T
V

A worst-case estimate, P
able power level (V
T
J
CC
(max), at a selected R

= 12 V, I
T = P
P
CC
D
T
= V
= 7.5 mA, and R
J
D
= T
×
CC
CC
J
A
. (Thermal data is also available on the
JA
(max), I
T = P
R
P
+ T = 25°C + 11.3°C = 36.3°C
×
T
JA
JA
D
D
. Ambient air temperature, T
J
(max), represents the maximum allow-
= V
I
= T
CC
and T
= 90 mW
J(max)
D
IN
= 12 V
A
CC
×
J
+ ΔT
, at P
×
(max)), without exceeding
A
. Under certain combinations of
JA
R
.
I
JA
IN
JA
= 126 °C/W, then:
True Zero-Speed, High Accuracy Gear Tooth Sensor IC
D
×
×
.
, is a figure of merit sum-
7.5 mA = 90 mW
126 °C/W = 11.3°C
JC
A
= 25°C,
, is relatively
A
, and air
D
Power Derating
), can
(1)
(2)
(3)
Example: Reliability for V
single-layer PCB.
Observe the worst-case ratings for the device, specifically:
R
I
Calculate the maximum allowable power level, P
invert equation 3:
This provides the allowable increase to T
power dissipation. Then, invert equation 2:
Finally, invert equation 1 with respect to voltage:
The result indicates that, at T
dissipate adequate amounts of heat at voltages ≤ V
Compare V
reliable operation between V
enhanced R
V
CC
JA
CC
V
T
(max) = 12 mA.
CC
(est) and V
= 126 °C/W, T
P
max
(est) = P
D
= T
(max) = T
CC
JA
J
(est) to V
(max) – T
. If V
D
CC
(max) ÷ I
(max) is reliable under these conditions.
J
(max) = 165°C, V
CC
max
(est) ≥ V
CC
A
÷ R
CC
= 165 °C – 150 °C = 15 °C
(max). If V
CC
115 Northeast Cutoff
1.508.853.5000; www.allegromicro.com
Allegro MicroSystems, Inc.
Worcester, Massachusetts 01615-0036 U.S.A.
(max) = 119 mW ÷ 12 mA = 9.9 V
JA
A
CC
at T
, the application and device can
(est) and V
= 15°C ÷ 126 °C/W = 119 mW
CC
A
(max), then operation between
= 150°C, package SG, using a
CC
CC
(est) ≤ V
(max) = 24 V, and
J
CC
resulting from internal
(max) requires
CC
D
CC
(max). First,
(max), then
(est).
12