CY62167ELL-45ZXI Cypress Semiconductor Corp, CY62167ELL-45ZXI Datasheet - Page 6

CY62167ELL-45ZXI

CY62167ELL-45ZXI

Manufacturer Part Number
CY62167ELL-45ZXI
Description
CY62167ELL-45ZXI
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY62167ELL-45ZXI

Format - Memory
RAM
Memory Type
SRAM
Memory Size
16M (2M x 8 or 1M x 16)
Speed
45ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP I
Density
16Mb
Access Time (max)
45ns
Sync/async
Asynchronous
Architecture
SDR
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
5V
Address Bus
21/20Bit
Package Type
TSOP-I
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
30mA
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Word Size
8/16Bit
Number Of Words
2M/1M
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
CY62167ELL-45ZXI
Manufacturer:
CYPRESSRESS
Quantity:
5 530
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CY62167ELL-45ZXI
Manufacturer:
CYP
Quantity:
3 586
Part Number:
CY62167ELL-45ZXI
Manufacturer:
CYPRESS
Quantity:
624
Part Number:
CY62167ELL-45ZXI
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Switching Characteristics
Over the Operating Range
Notes
Document Number: 001-15607 Rev. *B
READ CYCLE
t
t
t
t
t
t
t
t
t
t
t
t
t
t
WRITE CYCLE
t
t
t
t
t
t
t
t
t
t
t
Parameter
17. Test conditions for all parameters other than tristate parameters assume signal transition time of 1 V/ns, timing reference levels of V
18. AC timing parameters are subject to byte enable signals (BHE or BLE) not switching when chip is disabled. See
19. At any temperature and voltage condition, t
20. t
21. The internal write time of the memory is defined by the overlap of WE, CE
RC
AA
OHA
ACE
DOE
LZOE
HZOE
LZCE
HZCE
PU
PD
DBE
LZBE
HZBE
WC
SCE
AW
HA
SA
PWE
BW
SD
HD
HZWE
LZWE
of 0 to V
a write and any of these signals can terminate a write by going inactive. The data input setup and hold timing should be referenced to the edge of the signal that
terminates the write.
HZOE
, t
HZCE
CC
[17, 18]
(typ), and output loading of the specified I
, t
HZBE
[21]
, and t
Read cycle time
Address to data valid
Data hold from address change
CE
OE LOW to data valid
OE LOW to low Z
OE HIGH to high Z
CE
CE
CE
CE
BLE/BHE LOW to data valid
BLE/BHE LOW to low Z
BLE/BHE HIGH to high Z
Write cycle time
CE
Address setup to write end
Address hold from write end
Address setup to write start
WE pulse width
BLE/BHE LOW to write end
Data setup to write end
Data hold from write end
WE LOW to high Z
WE HIGH to low Z
1
1
1
1
1
1
HZWE
LOW and CE
LOW and CE
HIGH and CE
LOW and CE
HIGH and CE
LOW and CE
transitions are measured when the outputs enter a high impedance state.
[19]
2
2
2
2
HZCE
2
2
[19]
[19, 20]
[19, 20]
HIGH to data valid
HIGH to low Z
HIGH to power-up
HIGH to write end
LOW to high Z
LOW to power-down
is less than t
[19]
[19, 20]
OL
/I
OH
as shown in
Description
LZCE
[19]
[19, 20]
, t
HZBE
“AC Test Loads and Waveforms”
is less than t
1
= V
IL
, BHE or BLE or both = V
LZBE
, t
HZOE
is less than t
IL
on page 5.
, and CE
LZOE
application note AN13842
, and t
2
= V
IH
HZWE
. All signals must be active to initiate
Min
45
10
10
10
45
35
35
35
35
25
10
5
0
0
0
0
CY62167E MoBL
is less than t
45 ns
CC
(typ)/2, input pulse levels
for further clarification.
Max
45
45
22
18
18
45
45
18
18
LZWE
for any device.
Page 6 of 15
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
®
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