CY7C1470V33-200AXC Cypress Semiconductor Corp, CY7C1470V33-200AXC Datasheet - Page 15

• Manufacturer Part Number: CY7C1470V33-200AXC
• Description: IC,SYNC SRAM,2MX36,CMOS,QFP,100PIN,PLASTIC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1470V33-200AXC

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 72M (2M x 36)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The SRAM clock input might not be captured correctly if there is
no way in a design to stop (or slow) the clock during a
SAMPLE/PRELOAD instruction. If this is an issue, it is still
possible to capture all other signals and simply ignore the value
of the CLK captured in the boundary scan register.
After the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO balls.
Note that since the PRELOAD part of the command is not
implemented, putting the TAP to the Update-DR state while
performing a SAMPLE/PRELOAD instruction will have the same
effect as the Pause-DR command.
TAP Timing Diagram
TAP AC Switching Characteristics
Over the Operating Range
Document Number: 38-05289 Rev. *M
Clock
t
t
t
t
Output Times
t
t
Setup Times
t
t
t
Hold Times
t
t
t
Notes
Parameter
TCYC
TF
TH
TL
TDOV
TDOX
TMSS
TDIS
CS
TMSH
TDIH
CH
12. t
13. Test conditions are specified using the load in TAP AC Test Conditions. t
CS
and t
CH
refer to the setup and hold time requirements of latching data from the boundary scan register.
TCK clock cycle time
TCK clock frequency
TCK clock HIGH time
TCK clock LOW time
TCK clock LOW to TDO valid
TCK clock LOW to TDO invalid
TMS setup to TCK clock rise
TDI setup to TCK clock rise
Capture setup to TCK rise
TMS hold after TCK clock rise
TDI hold after clock rise
Capture hold after clock rise
Test M ode Select
Test Data-Out
Test Data-In
Test Clock
(TDO)
(TM S)
(TCK )
(TDI)
[12, 13]
1
Description
t TM SS
t TDIS
2
t TM SH
t TDIH
t TH
DON’T CA RE
R
t
TL
/t
F
= 1 ns.
3
BYPASS
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO balls. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
t CY C
UNDEFINED
4
t TDOX
t TDOV
5
Min
50
20
20
–
–
0
5
5
5
5
5
5
6
Max
20
10
–
–
–
–
–
–
–
–
–
–
CY7C1470V33
CY7C1472V33
CY7C1474V33
Page 15 of 33
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
[+] Feedback