DG604EQ-T1-E3 Vishay, DG604EQ-T1-E3 Datasheet - Page 2

1.0pC Charge Injection, 4-CH MUX

DG604EQ-T1-E3

Manufacturer Part Number
DG604EQ-T1-E3
Description
1.0pC Charge Injection, 4-CH MUX
Manufacturer
Vishay
Datasheet

Specifications of DG604EQ-T1-E3

Function
Multiplexer
Circuit
2 x 1:1
On-state Resistance
160 Ohm
Current - Supply
1µA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
14-TSSOP
Number Of Channels
1 Channel
On Resistance (max)
245 Ohm @ 3 V
On Time (max)
108 ns @ 3 V
Off Time (max)
76 ns @ 3 V
Supply Voltage (max)
12 V
Supply Voltage (min)
2.7 V
Maximum Power Dissipation
450 mW
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Switches
Single
Off Isolation (typ)
- 60 dB
Switch Current (typ)
0.000001 mA @ 5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DG604EQ-T1-E3TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DG604EQ-T1-E3
Manufacturer:
Vishay
Quantity:
23 772
DG604
Vishay Siliconix
Notes:
a. - 40 °C to 85 °C datasheet limits apply.
Notes:
a. Signals on SX, DX, or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
b. All leads welded or soldered to PC board.
c. Derate 5.6 mW/°C above 70 °C.
d. Derate 6.6 mW/°C above 70 °C.
e. Manual soldering with iron is not recommended for leadless components. The miniQFN-16 is a leadless package. The end of the lead terminal
www.vishay.com
2
TRUTH TABLE
ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS T
Parameter
V+ to V-
GND to V-
Digital Inputs
Continuous Current (Any Terminal)
Peak Current, S or D (Pulsed 1 ms, 10 % Duty Cycle)
Storage Temperature
Power Dissipation (Package)
Thermal Resistance (Package)
SPECIFICATIONS FOR DUAL SUPPLIES
Parameter
Analog Switch
Analog Signal Range
On-Resistance
On-Resistance Match
On-Resistance Flatness
is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper lip cannot be
guaranteed and is not required to ensure adequate bottom side solder interconnection.
- 40 °C to 125 °C
Temp. Range
Enable
Input
H
H
H
H
L
a
, V
S
, V
D
e
a
R
V
Symbol
R
FLATNESS
b
ANALOG
ΔR
DS(on)
b
ON
A1
H
H
X
L
L
V
IN A0, A1 and ENABLE
I
I
Selected Input
S
S
Unless Otherwise Specified
= 1 mA, V
= 1 mA, V
I
16 pin miniQFN
S
14 pin TSSOP
V+ = 5 V, V- = - 5 V
Test Conditions
= 1 mA, V
14 pin TSSOP
16 pin miniQFN
14 pin TSSOP
16 pin miniQFN
Package
A
D
D
= 25 °C, unless otherwise noted
= - 3 V, 0 V, + 3 V
= - 3 V, 0 V, + 3 V
D
New Product
A0
X
H
H
L
L
= 2.0 V, 0.8 V
= ± 3 V
c
d, e
a
Temp.
Room
Room
Room
Full
Full
Full
Full
b
or 30 mA, whichever occurs first
Typ.
70
10
1
(V-) - 0.3 to (V+) + 0.3
c
- 65 to 150
- 40 °C to 125 °C - 40 °C to 85 °C
All Switches Open
Min.
Limit
- 5
DG604EQ-T1-E3
On Switches
DG604EN-T1-E4
100
450
525
178
152
14
30
7
Part Number
d
D to S1
D to S2
D to S3
D to S4
DG604
Max.
115
160
6.5
20
33
5
5
S09-0280-Rev. B, 16-Feb-09
d
Document Number: 69934
Min.
- 5
d
Max.
115
140
6.5
20
22
5
5
d
Unit
C/W
mW
mA
°C
V
Unit
Ω
V

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