DSPIC33FJ16GS502-E/SO Microchip Technology, DSPIC33FJ16GS502-E/SO Datasheet - Page 286
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DSPIC33FJ16GS502-E/SO
Manufacturer Part Number
DSPIC33FJ16GS502-E/SO
Description
16 Bit MCU/DSP 40MIPS 16 KB FLASH SMPS 28 SOIC .300in TUBE
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ06GS101-ISO.pdf
(346 pages)
2.DSPIC33FJ06GS101-ISO.pdf
(18 pages)
3.DSPIC33FJ06GS101-ISO.pdf
(16 pages)
Specifications of DSPIC33FJ16GS502-E/SO
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ16GS502-E/SO
Manufacturer:
Johanson
Quantity:
40 000
- DSPIC33FJ06GS101-ISO PDF datasheet
- DSPIC33FJ06GS101-ISO PDF datasheet #2
- DSPIC33FJ06GS101-ISO PDF datasheet #3
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dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
24.1
TABLE 24-1:
TABLE 24-2:
TABLE 24-3:
DS70318D-page 284
Characteristic
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 44-Pin QFN
Package Thermal Resistance, 44-Pin TFQP
Package Thermal Resistance, 28-Pin SPDIP
Package Thermal Resistance, 28-Pin SOIC
Package Thermal Resistance, 28-Pin QFN-S
Package Thermal Resistance, 18-Pin SOIC
Note 1:
DC Characteristics
P
I/O = Σ ({V
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
– Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
-40
-40
-40
-40
dsPIC33FJ06GS101/X02 and
28
39
42
47
34
57
dsPIC33FJ16GSX02/X04
(T
P
© 2009 Microchip Technology Inc.
INT
J
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
40
40
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1
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