DSPIC33FJ16MC101-I/SO Microchip Technology, DSPIC33FJ16MC101-I/SO Datasheet - Page 248

• Manufacturer Part Number: DSPIC33FJ16MC101-I/SO
• Description: 16-bit Motor Control DSC Family, 16 MIPS, 16KB Flash, 1KB RAM 20 SOIC .300in TUB
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ16MC101-I/SO

• Processor Series: dsPIC33F
• Core: dsPIC
• Data Bus Width: 16 bit
• Program Memory Type: Flash
• Program Memory Size: 16 KB
• Interface Type: SPI, I2C, UART, JTAG
• Number Of Programmable I/os: 35
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Development Tools By Supplier: MPLAB IDE Software
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 13 Channel
• Featured Product: PIC24FJ/33FJ MCUs & dsPIC® DSCs
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 16 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 15
• Eeprom Size: -
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Lead Free Status / Rohs Status: Details

dsPIC33FJ16GP101/102 AND dsPIC33FJ16MC101/102
26.1
TABLE 26-1:
TABLE 26-2:
TABLE 26-3:
DS70652C-page 248
Characteristic
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 18-pin PDIP
Package Thermal Resistance, 20-pin PDIP
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 18-pin SOIC
Package Thermal Resistance, 20-pin SOIC
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 20-pin SSOP
Package Thermal Resistance, 28-pin SSOP
Package Thermal Resistance, 28-pin QFN (6x6 mm)
Package Thermal Resistance, 36-pin TLA (5x5 mm)
Note 1:
DC5
I/O = Σ ({V
DC Characteristics
P
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
3.0V-3.6V
3.0V-3.6V
(in Volts)
DD
OH
Characteristic
– Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
JA
JA
JA
JA
JA
A
A
D
J
J
31.1
Min
Typ
-40
-40
-40
-40
dsPIC33FJ16GP101/102 and
50
50
50
63
63
55
90
71
37
dsPIC33FJ16MC101/102
(T
P
© 2011 Microchip Technology Inc.
J
INT
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
16
16
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
°C/W
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1
1
1
1
1