DSPIC33FJ16MC102-E/SS Microchip Technology, DSPIC33FJ16MC102-E/SS Datasheet - Page 301
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC33FJ16MC102-E/SS
Manufacturer Part Number
DSPIC33FJ16MC102-E/SS
Description
16-bit Motor Control DSC Family, 16 MIPS, 16KB Flash, 1KB RAM 28 SSOP .209in TUB
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ16GP101-IP.pdf
(322 pages)
Specifications of DSPIC33FJ16MC102-E/SS
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Program Memory Type
Flash
Program Memory Size
16 KB
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 125 C
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
Core Processor
dsPIC
Core Size
16-Bit
Speed
16 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT
Number Of I /o
21
Eeprom Size
-
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SSOP (0.209", 5.30mm Width)
Lead Free Status / Rohs Status
Details
- Current page: 301 of 322
- Download datasheet (5Mb)
© 2011 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
dsPIC33FJ16GP101/102 AND dsPIC33FJ16MC101/102
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Preliminary
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
DS70652C-page 301
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