MM908E625ACDWB Freescale Semiconductor, MM908E625ACDWB Datasheet - Page 10

• Manufacturer Part Number: MM908E625ACDWB
• Description: IC QUAD HALF BRDG MCU/LIN 54SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MM908E625ACDWB

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• Ram Size: 512 x 8
• Interface: SCI, SPI
• Number Of I /o: 13
• Voltage - Supply: 8 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-SOIC (0.300", 7.50mm Width) Exposed Pad
• Program Memory Size: 16 KB
• Number Of Programmable I/os: 54
• Number Of Timers: 16
• Operating Supply Voltage: - 18 V to + 28 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 4. Dynamic Electrical Characteristics
microcontroller chip. Characteristics noted under conditions 9.0 V
Typical values noted reflect the approximate parameter mean at T
10
908E625
Table 5. Microcontroller Description
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
LIN PHYSICAL LAYER
HALL-EFFECT SENSOR INPUTS (H1:H3)
AUTONOMOUS WATCHDOG (AWD)
Notes
Propagation Delay
Output Falling Edge Slew Rate
Output Rising Edge Slew Rate
LIN Rise/Fall Slew Rate Symmetry
Propagation Delay
AWD Oscillator Period
AWD Period Low = 512 t
AWD Period High = 256 t
AWD Cyclic Wake-Up On Time
12.
13.
14.
All characteristics are for the analog chip only. Please refer to the specification for 68HC908EY16 for characteristics of the
TXD LOW to LIN LOW
TXD HIGH to LIN HIGH
LIN LOW to RXD LOW
LIN HIGH to RXD HIGH
TXD Symmetry
RXD Symmetry
80% to 20%
20% to 80%, R
For a detailed microcontroller description, refer to the MC68HC908EY16 data sheet.
All LIN characteristics are for initial LIN slew rate selection (20 kBaud) (SRS0:SRS1= 00).
See
See
Module
Timer
Flash
Core
RAM
ADC
SPI
Figure
Figure
2.
3.
BUS
(12)
,
> 1.0 kΩ, C
(13)
High-Performance HC08 Core with a Maximum Internal Bus Frequency of 8.0 MHz
Two 16-Bit Timers with Two Channels (TIM A and TIM B)
16 K Bytes
512 Bytes
10-Bit Analog-to-Digital Converter
SPI Module
OSC
OSC
Characteristic
(12)
(12)
BUS
,
,
(14)
(12)
(14)
< 10 nF
,
DYNAMIC ELECTRICAL CHARACTERISTICS
(14)
MICROCONTROLLER PARAMETRICS
≤
A
V
= 25°C under nominal conditions unless otherwise noted.
Description
SUP
t
t
t
TXD-LIN-
t
TXD-LIN-
LIN-RXD-
t
t
AWDHPON
t
≤
Symbol
TXD-SYM
RXD-SYM
t
t
LIN-RXD-
t
AWDPH
AWDPL
t
SR
SR
SR
HPPD
16 V, -40°C
high
OSC
F
R
S
high
low
low
-2.0
-2.0
-2.0
Min
-1.0
1.0
8.0
≤
16
–
–
–
–
–
–
–
T
Analog Integrated Circuit Device Data
J
≤
125°C unless otherwise noted.
-2.0
Typ
4.0
4.0
2.0
1.0
40
22
11
90
–
–
–
–
–
Freescale Semiconductor
Max
-3.0
6.0
6.0
8.0
8.0
2.0
2.0
3.0
2.0
28
14
–
–
–
Unit
V/µs
V/µs
ms
ms
µs
µs
µs
µs
µs