MM908E625ACDWB Freescale Semiconductor, MM908E625ACDWB Datasheet - Page 37

• Manufacturer Part Number: MM908E625ACDWB
• Description: IC QUAD HALF BRDG MCU/LIN 54SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MM908E625ACDWB

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• Ram Size: 512 x 8
• Interface: SCI, SPI
• Number Of I /o: 13
• Voltage - Supply: 8 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-SOIC (0.300", 7.50mm Width) Exposed Pad
• Program Memory Size: 16 KB
• Number Of Programmable I/os: 54
• Number Of Timers: 16
• Operating Supply Voltage: - 18 V to + 28 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

RUN Mode
provides a regulated supply to all digital sections.
parameters (e.g. ICG trim value) are stored in the flash memory
of the device. The following flash memory locations are
reserved for this purpose and might have a value different from
the “empty” (0xFF) state:
mounted onto a thermally enhanced PCB.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
During RUN mode the main voltage regulator is on. It
To enhance the ease-of-use of the 908E625, various
• 0xFD800xFDDF Trim and Calibration Values
• 0xFFFE:0xFFFF Reset Vector
Figure 21
shows a thermal response curve for a package
Figure 21. Thermal Response of H-Bridge Driver with Package Soldered to a JEDEC PCB Board
5.0
30
25
20
15
10
0.00001 0.0001
5
0
Freescale Semiconductor, Inc.
For More Information On This Product,
FACTORY TRIMMING AND CALIBRATION
0.001
PACKAGE THERMAL PERFORMANCE
Go to: www.freescale.com
0.01
0.1
Time (s)
STOP Mode
regulated output voltage. The STOP mode regulator has a very
limited output current capability. The output voltage will be
lower than the output voltage of the main voltage regulator.
to take care not to erase or override these values. If these
parameters are not used, these flash locations can be erased
and otherwise used.
planes (2s2p). The board conforms to JEDEC EIA/JESD 51-5
and JESD51-7. Substrate thickness is 1.60 mm. Top and
bottom copper trace layers are 0.7 mm thick, with two inner
copper planes of 0.35 mm thickness. Thermal vias have
0.35 mm thick plating.
During STOP mode the STOP mode regulator supplies a
In the event the application uses these parameters, one has
Note The PCB board is a multi-layer with two inner copper
1.0
1
10
100
1000
time[s]
10000
908E625
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