CYII5FM1300AB-QWC Cypress Semiconductor Corp, CYII5FM1300AB-QWC Datasheet - Page 17

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CYII5FM1300AB-QWC

Manufacturer Part Number
CYII5FM1300AB-QWC
Description
IC SENSOR IMAGE 1.3MP 84-LCC
Manufacturer
Cypress Semiconductor Corp
Type
CMOS Imagingr

Specifications of CYII5FM1300AB-QWC

Pixel Size
6.7µm x 6.7µm
Active Pixel Array
1280H x 1024V
Frames Per Second
27
Voltage - Supply
3 V ~ 4.5 V
Package / Case
84-LCC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Table 15. Internal Registers (continued)
Detailed Description of Internal Registers
Sequencer register (7:0)
Document #: 38-05710 Rev. *H
Note
1. Shutter type (bit 0)
2. Output amplifier calibration (bits 1 and 2)
3. Continuous charge (bit 3)
4. Internal clock granularities (bits 4, 5, 6 and 7)
7. Using a SYS_CLOCK of 40 MHz (25 ns period).
10 (1010)
11 (1011)
12 (1100)
13 (1101)
14 (1110)
Register
15 (1111)
9 (1001)
The IBIS5-B-1300 image sensor has two shutter types:
0 = synchronous shutter
1 = rolling shutter
Bits FRAME_CAL_MODE and LINE_CAL_MODE define the
calibration mode of the output amplifier.
During every row-blanking period, a calibration is done of the
output amplifier. There are two calibration modes. The FAST
mode (0) forces a calibration in one cycle but is not so accu-
rate and suffers from KTC noise. The SLOW mode (1) only
makes incremental adjustments and is noise free.
Approximately 200 or more ’slow’ calibrations have the same
effect as one ’fast’ calibration. Different calibration modes are
set at the beginning of the frame (FRAME_CAL_MODE bit)
and for every subsequent line that is read (LINE_CAL_MODE
bit). The Y_START input defines the beginning of a frame,
Y_CLOCK defines the beginning of a new row.
Some applications may require the use continuous charging
of the pixel columns instead of a pre-charge on every line
sample operation.
Setting bit CONT_CHARGE to ’1’ activates this function. The
resistor connected to pin PC_CMD controls the current level
on every pixel column.
The system clock is divided several times on-chip. Half the
system clock rate clocks the X-shift-register that controls the
column/pixel readout. Odd and even pixel columns are
switched to two separate buses. In the output amplifier, the
pixel signals on the two buses are combined into one pixel
stream at the same frequency as SYS_CLOCK.
Bit
6:0
6:0
2:0
0
1
2
DACRAW_REG
DACFINE_REG
ADC register
TRISTATE_OUT
GAMMA
BIT_INV
Reserved
Reserved
Reserved
Reserved
Name
Amplifier DAC raw offset
Default value <6:0>: ’1000000’
Amplifier DAC fine offset
Default value <6:0>: ’1000000’
Default value <2:0>: ’011’
0 = Output bus in tri-state
0 = Gamma-correction on
1 = Bit inversion on output bus
.
Table 16. SS Sequencer Clock Granularities
The clock that drives the X-sequencer is a multiple of 4, 8, 16, or
32 times the system clock. Clocking the X-sequencer at a slower
rate (longer row blanking time; pixel read out speed is always
equal to the SYSTEM_CLOCK) results in more signal swing for
the same light conditions.
Table 17. X Sequencer Clock Granularities
5. Pixel reset knee-point for multiple slope operation (bits 8, 9,
GRAN_SS_SEQ_MSB/
GRAN_X_SEQ_MSB/
Use
GRAN_SS_SEQ_LSB (bit 6) to program the clock that drives
the ’snapshot’ or synchronous shutter sequencer. This way
the integration time in synchronous shutter mode is a multiple
of 32, 64, 128, or 256 times the system clock period. To over-
come global reset issues, use the longest SS granularity (bits
6 and 7 set to '1').
and 10)
In normal (single slope) mode the pixel reset is controlled from
the left side of the image core using the voltage applied on pin
VDDR_LEFT as pixel reset voltage. In multiple slope opera-
tion, apply one or more variable pixel reset voltages.
the
LSB
LSB
00
01
10
00
01
10
11
11
bits
Description
GRAN_SS_SEQ_MSB
128 × SYS_CLOCK
256 × SYS_CLOCK
16 × SYS_CLOCK
32 × SYS_CLOCK
32 × SYS_CLOCK
64 × SYS_CLOCK
4 × SYS_CLOCK
8 × SYS_CLOCK
SS-Sequencer
X-Sequencer
Clock
Clock
CYII5SM1300AB
Row Blanking
(bit
Time Step
Page 17 of 35
Integration
Time
800 ns
1.6 μs
3.2 μs
6.4 μs
3.5 μs
14 μs
28 μs
7 μs
7)
[7]
and
[7]
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