CYII5FM1300AB-QWC Cypress Semiconductor Corp, CYII5FM1300AB-QWC Datasheet - Page 29

• Manufacturer Part Number: CYII5FM1300AB-QWC
• Description: IC SENSOR IMAGE 1.3MP 84-LCC
• Manufacturer: Cypress Semiconductor Corp
• Type: CMOS Imagingr

Specifications of CYII5FM1300AB-QWC

• Pixel Size: 6.7µm x 6.7µm
• Active Pixel Array: 1280H x 1024V
• Frames Per Second: 27
• Voltage - Supply: 3 V ~ 4.5 V
• Package / Case: 84-LCC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

CYII5SM1300AB
Pad Position and Packaging
Bare Die
The IBIS5-B-1300 image sensor has 84 pins, 21 pins on every edge. The die size from pad-edge to pad-edge (without scribe-line) is:
10156.5 µm (x) by 9297.25 µm (y). Scribe lines take about 100 to 150 µm extra on each side. Pin 1 is located in the middle of the left
side, indicated by a ‘1’ on the layout. A logo and some identification tags are on the top right of the die.
Figure 29. IBIS5-B-1300 Bare Die Dimensions (All dimensions in µm)
Test structure
Identification
Document #: 38-05710 Rev. *H
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