BAS56,235 NXP Semiconductors, BAS56,235 Datasheet - Page 8

• Manufacturer Part Number: BAS56,235
• Description: DIODE DUAL SW 120V 200MA SOT143
• Manufacturer: NXP Semiconductors

Specifications of BAS56,235

• Package / Case: SOT-143, SOT-143B, TO-253AA
• Voltage - Forward (vf) (max) @ If: 1V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 120V
• Current - Average Rectified (io) (per Diode): 200mA (DC)
• Voltage - Dc Reverse (vr) (max): 60V
• Reverse Recovery Time (trr): 6ns
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 2 Independent
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 60 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 9 A
• Configuration: Dual Parallel
• Recovery Time: 6 ns
• Forward Voltage Drop: 1 V
• Maximum Reverse Leakage Current: 0.1 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 933742310235; BAS56 /T3; BAS56 /T3

NXP Semiconductors
11. Soldering
BAS56
Product data sheet
Fig 9.
Fig 10. Wave soldering footprint BAS56 (SOT143B)
4.6
(3×)
0.7
0.7
2.575
Reflow soldering footprint BAS56 (SOT143B)
(3×)
0.6
0.6
All information provided in this document is subject to legal disclaimers.
0.75
(3×)
(3×)
0.6
0.5
0.9
1
Rev. 3 — 29 June 2010
3.25
1.9
4.45
2.2
1.2
0.95
(3×)
1.2
1
2
3
1.425
1.425
(3×)
preferred transport direction during soldering
High-speed double diode
Dimensions in mm
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
BAS56
solder lands
solder resist
occupied area
sot143b_fr
sot143b_fw
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