BAS70-04LT1G ON Semiconductor, BAS70-04LT1G Datasheet - Page 3

DIODE SCHOTTKY DUAL 70V SOT-23

BAS70-04LT1G

Manufacturer Part Number
BAS70-04LT1G
Description
DIODE SCHOTTKY DUAL 70V SOT-23
Manufacturer
ON Semiconductor
Datasheets

Specifications of BAS70-04LT1G

Voltage - Forward (vf) (max) @ If
1V @ 15mA
Current - Reverse Leakage @ Vr
10µA @ 70V
Voltage - Dc Reverse (vr) (max)
70V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Product
Schottky Diodes
Peak Reverse Voltage
70 V
Forward Continuous Current
0.07 A
Configuration
Dual Series
Forward Voltage Drop
1 V @ 0.015 A
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
- 55 C to + 150 C
Mounting Style
SMD/SMT
Capacitance, Junction
2 pF
Current, Surge
100 mA
Package Type
SOT-23 (TO-236AB)
Power Dissipation
225 mW
Primary Type
Schottky Barrier
Speed, Switching
Fast
Temperature, Junction, Maximum
+150 °C
Temperature, Operating
-55 to +150 °C
Voltage, Forward
1 V
Voltage, Reverse
70 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Current - Average Rectified (io) (per Diode)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
BAS70-04LT1GOSTR

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Company
Part Number
Manufacturer
Quantity
Price
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BAS70-04LT1G
Manufacturer:
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Quantity:
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Part Number:
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Manufacturer:
ON Semiconductor
Quantity:
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Part Number:
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A
A1
E
1
3
D
e
2
b
H
E
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
SOLDERING FOOTPRINT*
PACKAGE DIMENSIONS
0.8
VIEW C
L1
SOT-23 (TO-236)
BAS70-04LT1
L
CASE 318-08
ISSUE AN
q
0.25
3
c
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318-01 THRU -07 AND -09 OBSOLETE, NEW
0.079
STYLE 8:
2.0
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318-08.
DIM
PIN 1. ANODE
inches
A1
H
L1
A
b
D
E
c
e
L
mm
E
2. NO CONNECTION
3. CATHODE
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
1.11
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX

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