TGF2021-12 TriQuint, TGF2021-12 Datasheet - Page 7

• Manufacturer Part Number: TGF2021-12
• Description: RF GaAs DC-12GHz 12mm Pwr pHEMT (0.35um)
• Manufacturer: TriQuint

Specifications of TGF2021-12

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1031678

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during
handing, assembly and test.
TriQuint Semiconductor Texas: Phone [phone] Fax [phone] [e-mail] www.triquint.com
GATE
Units: millimeters (inches)
Bond pads # 1-8:
Bond pads # 9-16: (Drain)
Bond Pad #17:
Bond Pad #18:
*Note: Bond pads #17 & 18 are alternate gate pads
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
that can be used for paralleling FETs.
1.945 [0.077]
1.625 [0.064]
1.305 [0.051]
2.930 [0.115]
2.829 [0.111]
2.585 [0.102]
2.265 [0.089]
0.985 [0.039]
0.665 [0.026]
0.345 [0.014]
0.096 [0.004]
0.000 [0.000]
Mechanical Drawing
(Gate)
(Vg*)
(Vg*)
8
7
6
1
5
4
3
2
18
17
0.090 x 0.090 (0.004 x 0.004)
0.090 x 0.090 (0.004 x 0.004)
0.090 x 0.090 (0.004 x 0.004)
0.090 x 0.090 (0.004 x 0.004)
10
11
12
13
14
15
16
9
2.618 [0.103]
2.265 [0.089]
1.945 [0.077]
1.625 [0.064]
1.305 [0.051]
0.985 [0.039]
0.665 [0.026]
0.313 [0.012]
Product Datasheet
DRAIN
TGF2021-12
August 7, 2007
Rev -
7