BLF6G27-10G NXP Semiconductors, BLF6G27-10G Datasheet - Page 3

RF MOSFET Small Signal LDMOS TNS

BLF6G27-10G

Manufacturer Part Number
BLF6G27-10G
Description
RF MOSFET Small Signal LDMOS TNS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF6G27-10G

Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
1.256 Ohms
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
13 V
Continuous Drain Current
3.5 A
Maximum Operating Temperature
+ 225 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Package / Case
CDFM
Transistor Type
N Channel
Drain Source Voltage Vds
65V
Continuous Drain Current Id
3.5A
Power Dissipation Pd
10W
No. Of Pins
3
Rohs Compliant
Yes
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
65V
Output Power (max)
2W(Typ)
Power Gain (typ)@vds
19@28VdB
Frequency (min)
2.5GHz
Frequency (max)
2.7GHz
Package Type
CDFM
Pin Count
3
Forward Transconductance (typ)
0.8(Min)S
Drain Source Resistance (max)
1256@6.15Vmohm
Reverse Capacitance (typ)
3.6@28VpF
Operating Temp Range
-65C to 225C
Drain Efficiency (typ)
20%
Mounting
Surface Mount
Mode Of Operation
1-Carrier N-CDMA
Number Of Elements
1
Vswr (max)
10
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF6G27-10G,112

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NXP Semiconductors
5. Thermal characteristics
6. Characteristics
7. Application information
BLF6G27-10_BLF6G27-10G
Product data sheet
7.1 Ruggedness in class-AB operation
Table 5.
Table 6.
T
Table 7.
Mode of operation: Single carrier N-CDMA with pilot, paging, sync and 6 traffic channels (Walsh
codes 8 - 13). PAR 9.7 dB at 0.01 % probability on CCDF; Channel Bandwidth is 1.23 MHz;
f
T
[1]
The BLF6G27-10 and BLF6G27-10G are capable of withstanding a load mismatch
corresponding to VSWR = 10 : 1 through all phases under the following conditions:
V
Symbol
R
Symbol Parameter
V
V
I
I
I
g
R
C
Symbol
P
G
RL
η
ACPR
ACPR
1
DSS
DSX
GSS
j
case
DS
fs
D
(BR)DSS
GS(th)
L(AV)
th(j-case)
DS(on)
rs
= 2500 MHz; f
p
= 25
in
Measured within 30 kHz bandwidth.
= 28 V; I
= 25
885k
1980k
°
C per section; unless otherwise specified.
drain-source breakdown
voltage
gate-source threshold voltage
drain leakage current
drain cut-off current
gate leakage current
forward transconductance
drain-source on-state
resistance
feedback capacitance
°
C; unless otherwise specified; in a class-AB production circuit.
Thermal characteristics
Characteristics
Application information
Parameter
average output power
power gain
input return loss
drain efficiency
adjacent channel power ratio (885 kHz)
adjacent channel power ratio (1980 kHz) P
Parameter
thermal resistance from
junction to case
Dq
2
= 130 mA; P
All information provided in this document is subject to legal disclaimers.
= 2600 MHz; f
Rev. 3 — 28 February 2011
L
3
= P
BLF6G27-10; BLF6G27-10G
= 2700 MHz; RF performance at V
L(1dB)
Conditions
T
P
case
L
; f = 2700 MHz.
Conditions
V
V
V
V
V
V
V
V
I
V
f = 1 MHz
= 10 W (CW)
D
GS
DS
GS
GS
DS
GS
DS
GS
GS
= 0.6 A
= 80 °C;
= 0 V; I
= 10 V; I
= 0 V; V
= V
= 10 V
= 11 V; V
= 10 V; I
= V
= 0 V; V
GS(th)
GS(th)
D
DS
DS
D
D
Conditions
P
P
P
P
= 0.18 mA
+ 3.75 V;
DS
+ 3.75 V;
= 18 mA
= 0.9 A
L(AV)
L(AV)
L(AV)
L(AV)
L(AV)
Type
BLF6G27-10
BLF6G27-10G
= 28 V
= 28 V;
= 0 V
WiMAX power LDMOS transistor
= 2 W
= 2 W
= 2 W
= 2 W
= 2 W
DS
Min
65
1.4
-
2.7
-
0.8
328
-
= 28 V; I
[1]
[1]
-
Min
17.5
-
18
-
-
Typ
-
1.9
-
-
-
-
-
3.6
© NXP B.V. 2011. All rights reserved.
Dq
Typ
4.0
4.0
Typ Max Unit
2
19
−10 -
20
−49 −46
−64 −61
= 130 mA;
Max
-
2.4
1.4
-
140
-
1256
-
-
-
-
Unit
K/W
K/W
3 of 15
W
dB
dB
%
dBc
dBc
Unit
V
V
μA
A
nA
S
pF

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