BLF6G38-10 /T3 NXP Semiconductors, BLF6G38-10 /T3 Datasheet - Page 2

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BLF6G38-10 /T3

Manufacturer Part Number
BLF6G38-10 /T3
Description
RF MOSFET Small Signal LDMOS TNS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF6G38-10 /T3

Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
1.256 Ohms
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
13 V
Continuous Drain Current
3.1 A
Maximum Operating Temperature
+ 200 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Package / Case
CDFM
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
65V
Output Power (max)
2W(Typ)
Power Gain (typ)@vds
14@28VdB
Frequency (min)
3.4GHz
Frequency (max)
3.6GHz
Package Type
CDFM
Pin Count
3
Forward Transconductance (typ)
0.8(Min)S
Drain Source Resistance (max)
1256@6.15Vmohm
Reverse Capacitance (typ)
3.6@28VpF
Operating Temp Range
-65C to 200C
Drain Efficiency (typ)
20%
Mounting
Surface Mount
Mode Of Operation
1-Carrier N-CDMA
Number Of Elements
1
Vswr (max)
10
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF6G38-10,118
NXP Semiconductors
2. Pinning information
3. Ordering information
BLF6G38-10_BLF6G38-10G_1
Product data sheet
1.3 Applications
I
Table 2.
[1]
Table 3.
Pin
BLF6G38-10 (SOT975B)
1
2
3
BLF6G38-10G (SOT975C)
1
2
3
Type number Package
BLF6G38-10
BLF6G38-10G -
RF power amplifiers for base stations and multi carrier applications in the
3400 MHz to 3600 MHz frequency range
Connected to flange.
Pinning
Ordering information
Description
drain
gate
source
drain
gate
source
Name
-
Rev. 01 — 3 February 2009
Description
earless flanged ceramic package; 2 leads
earless flanged ceramic package; 2 leads
BLF6G38-10; BLF6G38-10G
[1]
[1]
Simplified outline
WiMAX power LDMOS transistor
1
2
1
2
Graphic symbol
© NXP B.V. 2009. All rights reserved.
Version
SOT975B
SOT975C
2
2
sym112
sym112
1
3
1
3
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