LPC1114FHN33/301:5 NXP Semiconductors, LPC1114FHN33/301:5 Datasheet - Page 17

LPC1114FHN33/HVQFN32/REEL13DP/

LPC1114FHN33/301:5

Manufacturer Part Number
LPC1114FHN33/301:5
Description
LPC1114FHN33/HVQFN32/REEL13DP/
Manufacturer
NXP Semiconductors
Series
LPC1100r

Specifications of LPC1114FHN33/301:5

Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
28
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
Processor Series
LPC11
Core
ARM Cortex M0
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Number Of Programmable I/os
28
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, KSK-LPC1114
Development Tools By Supplier
OM11049, OM11085
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Code size of 32 bits versus 16/8bit MCU’s
17

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