LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 4

• Manufacturer Part Number: LPC2364HBD100
• Description: LPC2364HBD100/LQFP100/TRAYBDP/
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2364HBD100

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Table 2.
Type number
LPC2364FBD100 128
LPC2364HBD100 128
LPC2364FET100
LPC2365FBD100 256
LPC2366FBD100 256
LPC2367FBD100 512
LPC2368FBD100 512
LPC2368FET100
Ordering options
4.1 Ordering options
Flash
(kB)
128
512
Local
bus
8
8
8
32
32
32
32
32
Ethernet
buffers
16
16
16
16
16
16
16
16
GP/USB RTC
8
8
8
8
8
8
8
8
SRAM (kB)
2
2
2
2
2
2
2
2
Total
34
34
34
58
58
58
58
58
Ethernet USB
RMII
RMII
RMII
RMII
RMII
RMII
RMII
RMII
device +
4 kB
FIFO
yes
yes
yes
no
yes
no
yes
yes
SD/MMC GP DMA
no
no
no
no
no
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
2
2
2
-
2
-
2
2
CAN ADC DAC
Channels
6
6
6
6
6
6
6
6
1
1
1
1
1
1
1
1
Temp range
−40 °C to +85 °C
−40 °C to +125 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C