BAW56,215 NXP Semiconductors, BAW56,215 Datasheet - Page 10

• Manufacturer Part Number: BAW56,215
• Description: DIODE SW DBL 90V 215MA HS SOT23
• Manufacturer: NXP Semiconductors

Specifications of BAW56,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1V @ 50mA
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Current - Average Rectified (io) (per Diode): 215mA (DC)
• Voltage - Dc Reverse (vr) (max): 90V
• Reverse Recovery Time (trr): 4ns
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Diode Configuration: 1 Pair Common Anode
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 90 V
• Forward Continuous Current: 0.215 A
• Max Surge Current: 4 A
• Configuration: Dual Common Anode
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Rectifier Type: Switching Diode
• Peak Rep Rev Volt: 90V
• Avg. Forward Curr (max): 0.215A
• Rev Curr: 0.5uA
• Peak Non-repetitive Surge Current (max): 4A
• Forward Voltage: 1.25V
• Operating Temp Range: -65C to 150C
• Package Type: TO-236AB
• Rev Recov Time: 4ns
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1626-2; 933098990215; BAW56 T/R

NXP Semiconductors
BAV756S_BAW56_SER_5
Product data sheet
Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB)
Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101)
4.60
Reflow soldering is the only recommended soldering method.
4.00
1.20
0.90
R = 0.05 (12 )
0.20
Rev. 05 — 26 November 2007
0.35
0.25
(2 )
(2 )
solder lands
solder paste
2
3.40
2.80
4.50
0.30
0.40
0.50
(2 )
(2 )
(2 )
3
1.20 (2x)
BAV756S; BAW56 series
1
1.30
0.30
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
0.30
0.40
0.50
Dimensions in mm
High-speed switching diodes
solder lands
solder resist
occupied area
R = 0.05 (12 )
0.60 0.70 0.80
© NXP B.V. 2007. All rights reserved.
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