BAV70W,115 NXP Semiconductors, BAV70W,115 Datasheet - Page 4

• Manufacturer Part Number: BAV70W,115
• Description: DIODE DUAL 100V 175MA H-S SC-70
• Manufacturer: NXP Semiconductors

Specifications of BAV70W,115

• Package / Case: SC-70-3, SOT-323-3
• Mounting Type: Surface Mount
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io) (per Diode): 175mA
• Diode Configuration: 1 Pair Common Cathode
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.175 A
• Max Surge Current: 4 A
• Configuration: Dual Common Cathode
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934024390115::BAV70W T/R::BAV70W T/R

NXP Semiconductors
6. Thermal characteristics
BAV70_SER_7
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
Table 7.
[1]
[2]
Symbol
P
Per device
I
T
T
T
Symbol
Per diode
R
R
R
F
j
amb
stg
tot
th(j-a)
th(j-t)
th(j-sp)
T
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
j
= 25 C prior to surge.
Limiting values
Thermal characteristics
Parameter
total power dissipation
forward current
junction temperature
ambient temperature
storage temperature
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to tie-point
thermal resistance from
junction to solder point
BAV70
BAV70M
BAV70S
BAV70T
BAV70W
BAV70
BAV70M
BAV70S
BAV70T
BAV70W
BAV70
BAV70M
BAV70W
BAV70
BAV70W
BAV70S
BAV70T
Rev. 07 — 27 November 2007
…continued
Conditions
T
T
T
T
T
T
T
T
T
T
Conditions
in free air
amb
amb
s
s
amb
amb
s
s
s
amb
= 60 C
= 90 C
= 90 C
= 60 C
= 90 C
25 C
25 C
25 C
25 C
25 C
High-speed switching diodes
[2]
[3]
[1]
[2]
BAV70 series
Min
-
-
-
-
-
-
-
-
-
-
-
Min
-
-
-
-
-
-
-
65
65
Typ
-
-
-
-
-
-
-
© NXP B.V. 2007. All rights reserved.
Max
250
250
350
170
200
125
75
100
75
100
150
+150
+150
Max
500
500
625
360
300
255
350
Unit
mW
mW
mW
mW
mW
mA
mA
mA
mA
mA
C
C
C
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
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