BAW56S,115 NXP Semiconductors, BAW56S,115 Datasheet - Page 11

• Manufacturer Part Number: BAW56S,115
• Description: DIODE ARRAY 90V 250MA H-S SOT363
• Manufacturer: NXP Semiconductors

Specifications of BAW56S,115

• Package / Case: SC-70-6, SC-88, SOT-363
• Mounting Type: Surface Mount
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Voltage - Forward (vf) (max) @ If: 1V @ 50mA
• Voltage - Dc Reverse (vr) (max): 90V
• Current - Average Rectified (io) (per Diode): 250mA (DC)
• Diode Configuration: 2 Pair Series Connection
• Product: Switching Diodes
• Peak Reverse Voltage: 90 V
• Forward Continuous Current: 0.25 A
• Max Surge Current: 4 A
• Configuration: Double Dual Common Anode
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934045730115::BAW56S T/R::BAW56S T/R

NXP Semiconductors
BAV756S_BAW56_SER_5
Product data sheet
Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88)
Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88)
Dimensions in mm
solder lands
solder resist
occupied area
Dimensions in mm
4.50
solder lands
solder resist
occupied area
solder paste
Rev. 05 — 26 November 2007
2.35
transport direction during soldering
0.50
(4 )
BAV756S; BAW56 series
0.50
(4 )
5.25
1.15
3.75
2.65
1.20
2.40
0.60
(2 )
High-speed switching diodes
0.40
(2 )
0.90 2.10
0.30
© NXP B.V. 2007. All rights reserved.
sot363
1.00
sot363
4.00
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