CMH08A(TE12L,Q) Toshiba, CMH08A(TE12L,Q) Datasheet - Page 3

• Manufacturer Part Number: CMH08A(TE12L,Q)
• Description: DIODE SW SGL 400V 2A 3-4E1A
• Manufacturer: Toshiba

Specifications of CMH08A(TE12L,Q)

• Voltage - Forward (vf) (max) @ If: 1.8V @ 2A
• Voltage - Dc Reverse (vr) (max): 400V
• Current - Average Rectified (io): 2A
• Current - Reverse Leakage @ Vr: 10µA @ 400V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 35ns
• Mounting Type: Surface Mount
• Package / Case: 3-4E1A (M-Flat)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Capacitance @ Vr, F: -
• Other names: CMH08A(TE12LQ)TR

0.01
0.1
100
160
140
120
100
10
80
60
40
20
1
0.5
0
0
Pulse test
0°
0.2
Rectangular
Waveform
Instantaneous forward voltage v
180°
360°
75°C
Average forward current I
1.0
0.4
0.6
1000
500
300
100
1.5
50
30
10
0.001
150°C
5
3
1
0.8
Tℓ max – I
T j = 25°C
1.0
i
F
0.003
2.0
– v
1.2 1.4
F
F (AV)
0.01
2.5
F (AV)
1.6 1.8
F
0.03
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
board thickness: 1.6 t
3.0
(A)
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 t
(V)
2.0
0.1
3.5
2.2
0.3
Time t (s)
r
th (j-a)
3
1
– t
3
160
140
120
100
2.8
2.4
2.0
1.6
1.2
0.8
0.4
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 t
80
60
40
20
0
0
0
0
10
0°
0.2
Rectangular
Waveform
180°
360°
0.4
Average forward current I
0.4
Average forward current I
30
0.6
0.8
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 t
100
0.8
P
Ta max – I
F (AV)
1.2
1.0
300
– I
1.2 1.4
F (AV)
1.6
F (AV)
1000
F (AV)
2.0
1.6 1.8 2.0
F (AV)
0°
Rectangular
Waveform
180°
360°
(A)
2.4
(A)
2005-02-04
CMH08A
2.8
2.2