PMEG1020EA,115 NXP Semiconductors, PMEG1020EA,115 Datasheet
PMEG1020EA,115
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PMEG1020EA,115 Summary of contents
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PMEG1020EA 2 A ultra low V Rev. 04 — 30 December 2008 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in SOD323 (SC-76) very ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number PMEG1020EA 4. Marking Table 4. Type number PMEG1020EA 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol FRM I FSM amb ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with copper clad 10 [3] Soldering point of cathode tab. 7. Characteristics Table unless otherwise specified. amb ...
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... NXP Semiconductors (mA (1) (2) ( 100 200 300 ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values MHz amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG1020EA_4 Product data sheet 2 A ultra low V mdb194 400 500 V (mV) F (1) T ...
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... NXP Semiconductors 8. Test information Fig 4. 9. Package outline Fig 5. 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PMEG1020EA SOD323 [1] For further information and the availability of packing methods, see PMEG1020EA_4 ...
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... NXP Semiconductors 11. Soldering 1.65 Fig 6. 2.75 Fig 7. PMEG1020EA_4 Product data sheet 2 A ultra low V 3.05 2.1 0.95 2 Reflow soldering footprint SOD323 (SC-76) 5 2 Wave soldering footprint SOD323 (SC-76) Rev. 04 — 30 December 2008 PMEG1020EA MEGA Schottky barrier rectifier ...
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... Document ID Release date PMEG1020EA_4 20081230 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 13 “Legal PMEG1020EA_3 20040206 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Revision history ...