PMBD914,215 NXP Semiconductors, PMBD914,215 Datasheet - Page 3

DIODE SW DBL 70V 215MA SOT23

PMBD914,215

Manufacturer Part Number
PMBD914,215
Description
DIODE SW DBL 70V 215MA SOT23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PMBD914,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)
100V
Current - Average Rectified (io)
215mA (DC)
Current - Reverse Leakage @ Vr
1µA @ 75V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
4ns
Capacitance @ Vr, F
1.5pF @ 0V, 1MHz
Mounting Type
Surface Mount
Product
Ultra Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
100 V
Forward Voltage Drop
1.25 V at 0.15 A
Recovery Time
4 ns
Forward Continuous Current
0.215 A
Max Surge Current
4 A
Reverse Current Ir
0.025 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1737-2
933856870215
PMBD914 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PMBD914,215
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
6. Thermal characteristics
7. Characteristics
PMBD914_6
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
Table 7.
[1]
[2]
Table 8.
T
[1]
[2]
Symbol
P
T
T
Symbol
R
R
Symbol
V
I
C
t
V
R
rr
amb
j
stg
tot
F
FR
th(j-a)
th(j-t)
d
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
T
Soldering point of cathode tab.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Soldering point of cathode tab.
When switched from I
When switched from I
= 25 C unless otherwise specified.
j
= 25 C prior to surge.
Parameter
forward voltage
reverse current
diode capacitance
reverse recovery time
forward recovery voltage
Limiting values
Thermal characteristics
Characteristics
Parameter
total power dissipation
junction temperature
storage temperature
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to tie-point
F
F
Rev. 06 — 11 February 2009
= 10 mA to I
= 10 mA; t
…continued
r
= 20 ns.
R
= 10 mA; R
Conditions
I
I
I
I
V
V
V
V
f = 1 MHz; V
F
F
F
F
R
R
R
R
= 1 mA
= 10 mA
= 50 mA
= 150 mA
= 25 V
= 75 V
= 25 V; T
= 75 V; T
Conditions
T
Conditions
in free air
amb
L
= 100 ; measured at I
j
j
R
25 C
= 150 C
= 150 C
= 0 V
Single high-speed switching diode
[1][3]
[1]
[2]
[1]
[2]
Min
-
-
Min
-
-
Min
-
-
-
-
-
-
-
-
-
-
-
R
65
= 1 mA.
PMBD914
Typ
-
-
Typ
-
-
-
-
-
-
-
-
-
-
-
© NXP B.V. 2009. All rights reserved.
Max
250
150
+150
Max
500
330
Max
715
855
1
1.25
25
1
30
50
1.5
4
1.75
Unit
mW
C
C
Unit
K/W
K/W
Unit
mV
mV
V
V
nA
pF
ns
V
3 of 10
A
A
A

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