BAS516,135 NXP Semiconductors, BAS516,135 Datasheet - Page 5
![DIODE SW 85V 250MA H-S SOD523](/photos/5/25/52584/568-sod-523_1-1g1a_sc-79_sod523_sml.jpg)
BAS516,135
Manufacturer Part Number
BAS516,135
Description
DIODE SW 85V 250MA H-S SOD523
Manufacturer
NXP Semiconductors
Datasheet
1.BAS16VY165.pdf
(20 pages)
Specifications of BAS516,135
Package / Case
SC-79, SOD-523
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)
100V
Current - Average Rectified (io)
250mA (DC)
Current - Reverse Leakage @ Vr
500nA @ 80V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
4ns
Capacitance @ Vr, F
1pF @ 0V, 1MHz
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
85 V
Forward Continuous Current
0.25 A
Max Surge Current
4 A
Configuration
Single
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
1 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934055217135
BAS516 /T3
BAS516 /T3
BAS516 /T3
BAS516 /T3
NXP Semiconductors
6. Thermal characteristics
BAS16_SER_5
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Table 7.
Symbol
Per device
T
T
T
Symbol
R
R
j
amb
stg
th(j-a)
th(j-t)
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB with 60 m copper strip line.
Single diode loaded.
T
Reflow soldering is the only recommended soldering method.
Soldering point of cathode tab.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Soldering points at pins 4, 5 and 6.
j
= 25 C prior to surge.
Limiting values
Thermal characteristics
Parameter
junction temperature
ambient temperature
storage temperature
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to tie-point
BAS16
BAS16H
BAS16J
BAS16L
BAS16VV
BAS16W
BAS16
BAS16W
Rev. 05 — 25 August 2008
…continued
Conditions
Conditions
in free air
[2][3]
[3][4]
[3][4]
[2][3]
[2][3]
[3][4]
High-speed switching diodes
[1]
[5]
[5]
[1]
BAS16 series
Min
-
-
-
-
-
-
-
-
-
-
Min
-
65
65
Typ
-
-
-
-
-
-
-
-
-
-
© NXP B.V. 2008. All rights reserved.
Max
150
+150
+150
Max
500
330
150
230
500
700
410
625
330
300
Unit
2
C
C
C
.
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
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