BAS21H,115 NXP Semiconductors, BAS21H,115 Datasheet - Page 7

• Manufacturer Part Number: BAS21H,115
• Description: DIODE SWITCH 200V 200MA SOD123
• Manufacturer: NXP Semiconductors

Specifications of BAS21H,115

• Package / Case: SOD-123 Flat Leads
• Voltage - Forward (vf) (max) @ If: 1.25V @ 200mA
• Voltage - Dc Reverse (vr) (max): 200V
• Current - Average Rectified (io): 200mA (DC)
• Current - Reverse Leakage @ Vr: 100nA @ 200V
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 50ns
• Capacitance @ Vr, F: 5pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 250 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 9 A
• Configuration: Single
• Recovery Time: 50 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 100 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934059307115; BAS21H T/R; BAS21H T/R

NXP Semiconductors
11. Soldering
12. Mounting
BAS21H_2
Product data sheet
Fig 7. Reflow soldering footprint SOD123F
Fig 8. FR4 PCB, standard footprint SOD123F
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
PCB thickness = 1.6 mm
1.6
(2 )
1.1
Rev. 02 — 3 November
Dimensions in mm
1.2
4.4
2.9
1.6
4
43.4
1.2
1.2
1.1 1.2
Single high-voltage switching diode
1.2
0.5
006aaa670
40
© NXP B.V. 2006. All rights reserved.
solder lands
solder resist
solder paste
occupied area
BAS21H
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