PMEG3005EL,315 NXP Semiconductors, PMEG3005EL,315 Datasheet
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PMEG3005EL,315
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PMEG3005EL,315 Summary of contents
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PMEG3005EB; PMEG3005EL 0.5 A very low V Rev. 01 — 29 November 2006 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in ultra small ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin SOD523 1 2 SOD882 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PMEG3005EB PMEG3005EL 4. Marking Table 5. Type number PMEG3005EB PMEG3005EL PMEG3005EB_PMEG3005EL_1 Product data sheet PMEG3005EB; PMEG3005EL 0.5 A very low V Pinning Description cathode ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol FRM I FSM P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] For Schottky barrier diodes thermal runaway has to be considered some applications the reverse ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol [1] Pulse test: t PMEG3005EB_PMEG3005EL_1 Product data sheet PMEG3005EB; PMEG3005EL 0.5 A very low V Characteristics Parameter Conditions forward voltage 100 500 mA F reverse current diode capacitance MHz R 300 s; 0.02. p Rev. 01 — 29 November 2006 MEGA Schottky barrier rectifi ...
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... NXP Semiconductors (mA (1) (2) (3) ( 0.2 0.4 0.6 0.8 ( 150 C amb ( 125 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values MHz amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG3005EB_PMEG3005EL_1 Product data sheet PMEG3005EB; PMEG3005EL ...
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... NXP Semiconductors 8. Test information Fig 4. Duty cycle definition 9. Package outline 0.85 0.75 1 1.65 1.25 1.55 1.15 2 0.34 0.26 Dimensions in mm Fig 5. Package outline SOD523 (SC-79) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number ...
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... NXP Semiconductors 11. Soldering Fig 7. Reflow soldering footprint SOD523 (SC-79) Fig 8. Reflow soldering footprint SOD882 PMEG3005EB_PMEG3005EL_1 Product data sheet PMEG3005EB; PMEG3005EL 0.5 A very low V 1.20 solder lands solder paste solder resist occupied area Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID PMEG3005EB_PMEG3005EL_1 20061129 PMEG3005EB_PMEG3005EL_1 Product data sheet PMEG3005EB; PMEG3005EL 0.5 A very low V Release date Data sheet status Product data sheet Rev. 01 — 29 November 2006 MEGA Schottky barrier rectifiers F Change notice Supersedes - - © NXP B.V. 2006. All rights reserved. ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Revision history ...