PMEG4020EP,115 NXP Semiconductors, PMEG4020EP,115 Datasheet
PMEG4020EP,115
Specifications of PMEG4020EP,115
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PMEG4020EP,115 Summary of contents
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PMEG4020EP 2 A low V Rev. 01 — 19 August 2009 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number PMEG4020EP 4. Marking Table 4. Type number PMEG4020EP 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol F(AV) I FSM P tot ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol amb T stg [1] Device mounted on a ceramic PCB prior to surge. j [3] Reflow soldering is the only recommended soldering method. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors duty cycle = th(j-a) (K/ 0.5 0.33 0.25 0.2 0.1 10 0.05 0.02 0. FR4 PCB, standard footprint Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 0 ...
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... NXP Semiconductors 2 10 duty cycle = 1 Z 0.75 th(j-a) (K/W) 0.5 0.33 0.25 0.2 10 0.1 0.05 0.02 0. Ceramic PCB standard footprint 2 3 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table unless otherwise specified. j Symbol ...
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... NXP Semiconductors (A) (1) 1 (2) (3) (4) ( 0.0 0.1 0.2 0.3 0.4 ( 150 125 Fig 4. Forward current as a function of forward voltage; typical values MHz amb Fig 6. Diode capacitance as a function of reverse voltage; typical values PMEG4020EP_1 Product data sheet 006aab681 ( 0.5 0.6 ...
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... NXP Semiconductors 1.2 P F(AV) (W) 0.8 (2) (1) 0.4 0.0 0.0 1 150 C j (1) = 0.1 (2) = 0.2 (3) = 0.5 ( Fig 7. Average forward power dissipation as a function of average forward current; typical values 3.0 I F(AV) (A) (1) 2.0 (2) (3) 1.0 (4) 0 100 FR4 PCB, standard footprint T = 150 ( kHz (3) = 0.2 ...
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... NXP Semiconductors 3.0 (1) I F(AV) (A) 2.0 (2) (3) 1.0 (4) 0 100 Ceramic PCB standard footprint 150 ( kHz ( kHz ( kHz Fig 11. Average forward current as a function of ambient temperature; typical values PMEG4020EP_1 Product data sheet 006aab686 3.0 I F(AV) (A) 2.0 1.0 ...
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... NXP Semiconductors 8. Test information Fig 13. Duty cycle definition The current ratings for the typical waveforms as shown in calculated according to the equations RMS 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications ...
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... NXP Semiconductors 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMEG4020EP [1] For further information and the availability of packing methods, see 11. Soldering 3.4 Fig 15. Reflow soldering footprint SOD128 PMEG4020EP_1 Product data sheet ...
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... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date PMEG4020EP_1 20090819 PMEG4020EP_1 Product data sheet 2 A low V Data sheet status Change notice Product data sheet - Rev. 01 — 19 August 2009 PMEG4020EP MEGA Schottky barrier rectifier F Supersedes - © NXP B.V. 2009. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information Soldering ...