STTH4R02B-TR STMicroelectronics, STTH4R02B-TR Datasheet - Page 6

DIODE ULT FAST 200V 4A DPAK

STTH4R02B-TR

Manufacturer Part Number
STTH4R02B-TR
Description
DIODE ULT FAST 200V 4A DPAK
Manufacturer
STMicroelectronics
Datasheet

Specifications of STTH4R02B-TR

Voltage - Forward (vf) (max) @ If
1.05V @ 4A
Voltage - Dc Reverse (vr) (max)
200V
Current - Average Rectified (io)
4A
Current - Reverse Leakage @ Vr
3µA @ 200V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
30ns
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Product
Ultra Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
200 V
Forward Voltage Drop
1.25 V at 12 A
Recovery Time
30 ns
Forward Continuous Current
4 A
Max Surge Current
70 A
Reverse Current Ir
3 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-5258-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STTH4R02B-TR
Manufacturer:
STMicroelectronics
Quantity:
56
Part Number:
STTH4R02B-TR
Manufacturer:
ST
Quantity:
120
Ordering information scheme
Figure 17. Thermal resistance versus lead length - DO-201AB
2
Figure 18. Ordering information scheme
6/13
Figure 15. Thermal resistance, junction to
110
100
90
80
70
60
50
40
30
20
10
0
0.0
0.5
Ordering information scheme
ambient, versus copper surface
under tab - SMB
1.0
Epoxy printed circuit board FR4,
copper thickness = 35 µm
1.5
2.0
2.5
3.0
90
80
70
60
50
40
30
20
10
0
5
Ultrafast switching diode
Average forward current
4 = 4 A
Model R
Repetitive peak reverse voltage
02 = 200 V
Package
Blank = DO-201 in Ammopack
RL = DO201 in Tape and reel
D = TO220AC in Tube
FP = TO-220FPAC in Tube
B = DPAK in Tube
B-TR = DPAK in Tape and reel
U = SMB in Tape and reel
S = SMC in Tape and reel
3.5
4.0
S
CU
(cm²)
4.5
10
Doc ID 12360 Rev 4
SMB
5.0
15
Figure 16. Thermal resistance, junction to
STTH
R
R
th(j-l)
th(j-a)
100
90
80
70
60
50
40
30
20
10
0
0.0
4 R
20
0.5
02 XXX
ambient, versus copper surface
under tab - SMC
L
LEADS
1.0
Epoxy printed circuit board FR4,
copper thickness = 35 µm
DO201AB
(mm)
1.5
25
2.0
S
CU
2.5
(cm²)
3.0
3.5
4.0
STTH4R02
4.5
SMC
5.0

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