STTH5L06B-TR STMicroelectronics, STTH5L06B-TR Datasheet - Page 5

DIODE ULTRA FAST 600V 5A DPAK

STTH5L06B-TR

Manufacturer Part Number
STTH5L06B-TR
Description
DIODE ULTRA FAST 600V 5A DPAK
Manufacturer
STMicroelectronics
Datasheet

Specifications of STTH5L06B-TR

Voltage - Forward (vf) (max) @ If
1.3V @ 5A
Voltage - Dc Reverse (vr) (max)
600V
Current - Average Rectified (io)
5A
Current - Reverse Leakage @ Vr
5µA @ 600V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
95ns
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Product
Ultra Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
600 V
Forward Voltage Drop
1.3 V
Recovery Time
95 ns
Forward Continuous Current
5 A
Max Surge Current
60 A
Reverse Current Ir
5 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-3248-2

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Part Number
Manufacturer
Quantity
Price
Part Number:
STTH5L06B-TR
Manufacturer:
BCD
Quantity:
10 000
Company:
Part Number:
STTH5L06B-TR
Quantity:
2 400
Company:
Part Number:
STTH5L06B-TR
Quantity:
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STTH5L06
Figure 11. Transient peak forward voltage
Figure 13. Junction capacitance versus
Figure 15. Thermal resistance junction to
10
80
70
60
50
40
30
20
10
100
9
8
7
6
5
4
3
2
1
0
0
10
1
0.0
0
V
1
R
C(pF)
FP
th(j-a)
I =I
T =125°C
F
j
(V)
F(AV)
0.5
20
(°C/W)
1.0
40
versus dI
reverse voltage applied (typical
values)
ambient versus copper surface
under each lead (epoxy printed
circuit board FR4, copper
thickness: 35µm) (DO-201AD)
1.5
60
10
80
2.0
dI /dt(A/µs)
F
S
DO-201AD
F
/dt (90% confidence)
CU
V (V)
100
R
2.5
(cm²)
120
3.0
100
140
3.5
160
4.0
V
OSC
F=1MHz
T =25°C
j
180
=30mV
4.5
1000
200
5.0
Figure 12. Forward recovery time versus dI
Figure 14. Thermal resistance junction to
80
70
60
50
40
30
20
10
200
180
160
140
120
100
80
60
40
20
0
0
0
R
0
t (ns)
fr
th(j-a)
2
20
(°C/W)
40
4
(90% confidence)
ambient versus copper surface
under tab (epoxy FR4, eCU = 35 µm)
(DPAK)
60
6
80
8
dI /dt(A/µs)
F
S
CU
100
10
(cm²)
120
12
140
14
Characteristics
V =1.1 x V max.
160
16
FR
T =125°C
I =I
F
j
F(AV)
180
F
18
F
5/10
/dt
200
20

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