IDB15E60 Infineon Technologies, IDB15E60 Datasheet - Page 2

• Manufacturer Part Number: IDB15E60
• Description: DIODE 600V 29.2A TO263-3
• Manufacturer: Infineon Technologies

Specifications of IDB15E60

• Package / Case: SC-70-6, SC-88, SOT-363
• Voltage - Forward (vf) (max) @ If: 2V @ 15A
• Voltage - Dc Reverse (vr) (max): 600V
• Current - Average Rectified (io): 29.2A (DC)
• Current - Reverse Leakage @ Vr: 50µA @ 600V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 87ns
• Mounting Type: Surface Mount
• Product: Power Diodes
• Peak Reverse Voltage: 600 V
• Forward Continuous Current: 15 A
• Max Surge Current: 60 A
• Configuration: Single
• Recovery Time: 87 ns
• Forward Voltage Drop: 2 V
• Maximum Reverse Leakage Current: 50 uA
• Maximum Power Dissipation: 83.3 W
• Operating Temperature Range: - 55 C to + 175 C
• Mounting Style: SMD/SMT
• Packages: PG-TO263-3
• If (typ): 15.0 A
• If (max): 29.2 A
• If,sm (max): 60.0 A
• Vf (typ): 1.5 V
• Ir (max): 50.0 µA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Capacitance @ Vr, F: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: IDB15E60XT

Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leaded
SMD version, device on PCB:
@ min. footprint
@ 6 cm
Electrical Characteristics, at T
Parameter
Static Characteristics
Reverse leakage current
V
V
Forward voltage drop
I
I
1 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Rev.2.2
F
F
R
R
=15A, T
=15A, T
=600V, T
=600V, T
2
cooling area
j
j
=25°C
=150°C
j
j
=25°C
=150°C
1)
j
= 25 °C, unless otherwise specified
Page 2
Symbol
R
R
R
Symbol
I
V
R
F
thJC
thJA
thJA
min.
min.
-
-
-
-
-
-
-
-
Values
Values
typ.
typ.
1.5
1.5
35
-
-
-
-
-
max.
max.
1250
1.8
2007-09-01
62
50
62
IDB15E60
2
-
-
Unit
K/W
Unit
µA
V