MBRS260T3G ON Semiconductor, MBRS260T3G Datasheet

MBRS260T3G

Manufacturer Part Number

MBRS260T3G

Description

DIODE SCHOTTKY 60V 2A SMB

Manufacturer

ON Semiconductor

Datasheet

1.MBRS260T3.pdf (4 pages)

Specifications of MBRS260T3G

Voltage - Forward (vf) (max) @ If

630mV @ 2A

Voltage - Dc Reverse (vr) (max)

60V

Current - Average Rectified (io)

Current - Reverse Leakage @ Vr

200µA @ 60V

Diode Type

Schottky

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Mounting Type

Surface Mount

Package / Case

DO-214AA, SMB

Product

Schottky Diodes

Peak Reverse Voltage

60 V

Forward Continuous Current

2 A

Max Surge Current

60 A

Configuration

Single

Forward Voltage Drop

0.63 V

Maximum Reverse Leakage Current

200 uA

Operating Temperature Range

- 55 C to + 125 C

Mounting Style

SMD/SMT

0713

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Reverse Recovery Time (trr)

Capacitance @ Vr, F

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Other names

MBRS260T3GOSTR

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Download datasheet (141Kb)

MBRS260T3

Surface Mount

Schottky Power Rectifier

SMB Power Surface Mount Package

metal−to−silicon power rectifier. Features epitaxial construction with

oxide passivation and metal overlay contact. Ideally suited for low

voltage, high frequency switching power supplies; free wheeling

diodes and polarity protection diodes.

Features

•

Mechanical Characteristics

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

MAXIMUM RATINGS

May, 2010 − Rev. 5

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

Average Rectified Forward Current

Non−Repetitive Peak Surge Current

Storage Temperature Range

Operating Junction Temperature

Voltage Rate of Change

This device employs the Schottky Barrier principle in a

260°C Max. for 10 Seconds

Leads are Readily Solderable

Compact Package with J−Bend Leads Ideal for Automated Handling

Highly Stable Oxide Passivated Junction

Guard−Ring for Over−Voltage Protection

Low Forward Voltage Drop

Pb−Free Package is Available

Case: Molded Epoxy

Epoxy Meets UL 94 V−0 @ 0.125 in

Weight: 95 mg (Approximately)

Cathode Polarity Band

Lead and Mounting Surface Temperature for Soldering Purposes:

Finish: All External Surfaces Corrosion Resistant and Terminal

ESD Ratings: Machine Model = C

(At Rated V

(Surge Applied at Rated Load Conditions

Halfwave, Single Phase, 60 Hz)

(Rated V

, T

Rating

= 25°C)

Human Body Model = 3B

= 95°C)

Symbol

dv/dt

FSM

RWM

RRM

stg

−55 to +150

−55 to +125

10,000

Value

2.0

Unit

V/ms

°C

†For information on tape and reel specifications,

MBRS260T3

MBRS260T3G

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Device

2.0 AMPERES, 60 VOLTS

SCHOTTKY BARRIER

ORDERING INFORMATION

B26

(Note: Microdot may be in either location)

MARKING DIAGRAM

http://onsemi.com

RECTIFIER

(Pb−Free)

Package

= Specific Device Code

= Assembly Location

= Year

= Work Week

= Pb−Free Package

CASE 403A

PLASTIC

SMB

AYWW

B26G

Publication Order Number:

2500/Tape & Reel

Shipping

MBRS260T3/D

†

Related parts for MBRS260T3G

MBRS260T3G Summary of contents

Page 1

... May, 2010 − Rev. 5 Symbol Value Unit RRM V RWM V R MBRS260T3 I 2 MBRS260T3G †For information on tape and reel specifications, FSM including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. T −55 to +150 °C stg T −55 to +125 °C J ...

Page 2

THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Ambient (Note 2) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3) Maximum Instantaneous Reverse Current (Note 3) 1. Mounted with minimum recommended pad size, PC Board FR4 inch ...

Page 3

SQUARE WAVE 1 100 T , LEAD TEMPERATURE (°C) L Figure 5. Current Derating − Junction to Lead 1.0E+00 50% 20% 1.0E−01 10% 5.0% 2.0% 1.0E−02 1.0% 1.0E−03 ...

Page 4

... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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