MBRS260T3G ON Semiconductor, MBRS260T3G Datasheet
MBRS260T3G
Specifications of MBRS260T3G
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MBRS260T3G Summary of contents
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... May, 2010 − Rev. 5 Symbol Value Unit RRM V RWM V R MBRS260T3 I 2 MBRS260T3G †For information on tape and reel specifications, FSM including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. T −55 to +150 °C stg T −55 to +125 °C J ...
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THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Ambient (Note 2) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3) Maximum Instantaneous Reverse Current (Note 3) 1. Mounted with minimum recommended pad size, PC Board FR4 inch ...
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SQUARE WAVE 1 100 T , LEAD TEMPERATURE (°C) L Figure 5. Current Derating − Junction to Lead 1.0E+00 50% 20% 1.0E−01 10% 5.0% 2.0% 1.0E−02 1.0% 1.0E−03 ...
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... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...