MUR550PF ON Semiconductor, MUR550PF Datasheet
MUR550PF
Specifications of MUR550PF
Related parts for MUR550PF
MUR550PF Summary of contents
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... Epoxy Meets UL 94 V−0 @ 0.125 in • Weight: MUR550APF: 1.1 Gram (Approximately) MURD550PF: 0.4 Gram (Approximately) MUR550PF, MURF550PF: 1.9 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260° ...
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... 520 150° Maximum Reverse Recovery Time (I = 1.0 A, di/ A/ms Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. Rating MUR550APF MURD550PF, MUR550PF, MURF550PF MUR550APF MURD550PF MUR550PF, MURF550PF Rating MURD550P, MUR550PF MURF550PF MUR550APF MURD550PF (Note 3) ,MURF550PF Rating = 25°C) J http://onsemi.com 2 Symbol ...
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NOTE 2 — AMBIENT MOUNTING DATA Data shown for thermal resistance junction−to−ambient (R ) for the mountings shown used as typical qJA guideline values for preliminary engineering or in case the tie point temperature cannot be measured. ...
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INSTANTANEOUS FORWARD VOLTAGE (VOLTS) F Figure 1. Typical Forward Voltage 1.0E−3 1.0E−4 150°C 1.0E−5 125°C 1.0E−6 1.0E−7 25°C 1.0E−8 1.0E−9 0 100 200 300 V ...
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SQUARE WAVE 5 0 100 110 120 130 140 150 T , CASE TEMPERATURE (°C) C Figure 5. Current Derating 100 100 0.5 10 0.2 0.1 0.05 1 0.01 0.1 Single Pulse 0.01 0.000001 0.00001 ...
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... Figure 9. Thermal Response for MURD550PF 10 0.5 1 0.2 0.1 0.05 0.01 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 Figure 10. Thermal Response for MUR550PF 0.5 0.2 1.0 0.1 0.05 0.02 0.1 0.01 SINGLE PULSE 0.01 0.001 0.000001 0.00001 0.0001 Figure 11. Thermal Response, (MURF550PF) Junction−to−Case (R ...
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D = 0.5 0.2 10 0.1 0.05 0.02 1.0 0.01 0.1 0.01 SINGLE PULSE 0.001 0.000001 0.00001 0.0001 Figure 12. Thermal Response, (MURF550PF) Junction−to−Ambient (R P (pk DUTY CYCLE 0.001 0.01 0.1 ...
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PACKAGE DIMENSIONS AXIAL LEAD CASE 267−05 ISSUE G NOTES DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH 267-04 OBSOLETE, NEW STANDARD 267-05. DIM MIN K A 0.287 B 0.189 ...
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... DETAIL 0.005 (0.13 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE GAUGE SEATING L2 C PLANE PLANE DETAIL A ROTATED 90 CW ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...