SP8M3FU6TB Rohm Semiconductor, SP8M3FU6TB Datasheet - Page 4

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SP8M3FU6TB

Manufacturer Part Number
SP8M3FU6TB
Description
MOSFET N/P-CH 30V 5A/4.5A 8SOIC
Manufacturer
Rohm Semiconductor
Datasheet

Specifications of SP8M3FU6TB

Fet Type
N and P-Channel
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
51 mOhm @ 5A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
5A, 4.5A
Vgs(th) (max) @ Id
2.5V @ 1mA
Gate Charge (qg) @ Vgs
5.5nC @ 5V
Input Capacitance (ciss) @ Vds
230pF @ 10V
Power - Max
2W
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Module Configuration
Dual
Transistor Polarity
N And P Channel
Continuous Drain Current Id
4.5A
Drain Source Voltage Vds
30V
On Resistance Rds(on)
82mohm
Rds(on) Test Voltage Vgs
10V
Threshold Voltage Vgs
RoHS Compliant
Configuration
Dual Dual Drain
Resistance Drain-source Rds (on)
0.051 Ohms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
5 A, - 4.5 A
Power Dissipation
2 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SP8M3FU6TB
Manufacturer:
KEIHIN
Quantity:
40
Part Number:
SP8M3FU6TB1
Manufacturer:
ROHM
Quantity:
125 422
Transistors
N-ch
Electrical characteristic curves
0.001
1000
0.01
100
0.1
1000
10
10
100
0.01
1
Fig.4 Typical Transfer Characteristics
10
0.0
1
0.1
Fig.1 Typical Capacitance
DRAIN-SOURCE VOLTAGE : V
GATE-SOURCE VOLTAGE : V
Ta=125°C
Ta=75°C
Ta=25°C
Ta= −25°C
0.5
Fig.7 Static Drain-Source
Ta=125°C
Ta=75°C
Ta=25°C
Ta= −25°C
vs. Drain-Source Voltage
0.1
1.0
DRAIN CURRENT : I
On-State Resistance
vs. Drain Current (Ι)
1.5
2.0
1
1
2.5
10
3.0
Ta=25°C
f=1MHz
V
D
V
Pulsed
V
Pulsed
GS
DS
(A)
GS
GS
=0V
DS
=10V
3.5
=10V
C
C
C
(V)
(V)
iss
oss
rss
100
4.0
10
10000
1000
1000
100
100
300
250
200
150
100
10
10
1
0.01
50
1
0.1
0
Fig.2 Switching Characteristics
0
Fig.5 Static Drain-Source
Ta=125°C
Ta=75°C
Ta=25°C
Ta= −25°C
t
t
d (off)
d (on)
GATE-SOURCE VOLTAGE : V
Fig.8 Static Drain-Source
t
t
f
r
2
DRAIN CURRENT : I
DRAIN CURRENT : I
On-State Resistance vs.
Gate-Source Voltage
On-State Resistance
vs. Drain Current (ΙΙ)
4
0.1
I
I
D
D
=5A
=2.5A
6
1
8
10
1
D
D
12
Ta=25°C
V
V
R
Pulsed
V
Pulsed
(A)
(A)
Ta=25°C
Pulsed
DD
GS
G
GS
=10Ω
=15V
=10V
=4.5V
GS
14
(V)
10
10
1
6
0.01
1000
0.1
100
10
10
10
1
1
9
8
7
6
5
4
3
2
1
0
0.0
0.1
Fig.3 Dynamic Input Characteristics
0
Ta=25°C
V
I
R
Pulsed
D
SOURCE-DRAIN VOLTAGE : V
DD
Ta=125°C
Ta=75°C
Ta=25°C
Ta= −25°C
=5A
G
Fig.9 Static Drain-Source
Fig.6 Source Current vs.
Ta=125°C
Ta=75°C
Ta=25°C
Ta= −25°C
=10Ω
TOTAL GATE CHARGE : Qg (nC)
=15V
1
DRAIN CURRENT : I
2
On-State Resistance
vs. Drain Current (ΙΙΙ)
Source-Drain Voltage
0.5
Rev.A
3
1
4
5
SP8M3
1.0
D
6
(A)
V
Pulsed
V
Pulsed
GS
GS
SD
7
=0V
=4V
(V)
4/5
1.5
10
8

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