NTGD4167CT1G ON Semiconductor, NTGD4167CT1G Datasheet - Page 10

MOSFET N/P-CH 30V DUAL 6-TSOP

NTGD4167CT1G

Manufacturer Part Number
NTGD4167CT1G
Description
MOSFET N/P-CH 30V DUAL 6-TSOP
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTGD4167CT1G

Fet Type
N and P-Channel
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
90 mOhm @ 2.6A, 4.5V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
2.6A, 1.9A
Vgs(th) (max) @ Id
1.5V @ 250µA
Gate Charge (qg) @ Vgs
5.5nC @ 4.5V
Input Capacitance (ciss) @ Vds
295pF @ 15V
Power - Max
900mW
Mounting Type
Surface Mount
Package / Case
SC-74-6
Configuration
Dual
Transistor Polarity
N and P-Channel
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 12 V
Continuous Drain Current
2.2 A
Power Dissipation
1100 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

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Quantity:
4 800
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Quantity:
30 000
Part Number:
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Quantity:
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Company:
Part Number:
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Quantity:
15 000
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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0.05 (0.002)
H
E
e
A1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
6
1
D
5
2
0.075
*For additional information on our Pb−Free strategy and soldering
3
4
1.9
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
b
0.037
0.037
0.95
0.95
A
E
SOLDERING FOOTPRINT*
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
http://onsemi.com
L
CASE 318G−02
TSOP−6
ISSUE T
0.094
2.4
c
10
q
0.039
1.0
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. DIMENSIONS A AND B DO NOT INCLUDE
STYLE 13:
DIM
PIN 1. GATE 1
H
A1
SCALE 10:1
ANSI Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
b
D
E
L
q
c
e
E
2. SOURCE 2
3. GATE 2
4. DRAIN 2
5. SOURCE 1
6. DRAIN 1
0.028
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0.7
MILLIMETERS
inches
NOM
1.00
0.06
0.38
0.18
3.00
1.50
0.95
0.40
2.75
mm
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
MIN
NTGD4167C/D
INCHES
0.039
0.002
0.014
0.007
0.059
0.037
0.016
0.108
NOM
0.118
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
MAX
10°

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