TDA1519CU NXP Semiconductors, TDA1519CU Datasheet - Page 19

• Manufacturer Part Number: TDA1519CU
• Description: Audio Amplifiers 22W BTL 2x11W PWR AMP
• Manufacturer: NXP Semiconductors

Specifications of TDA1519CU

• Product: Class-B
• Output Power: 22 W
• Available Set Gain: 46 dB
• Thd Plus Noise: 0.1 %
• Operating Supply Voltage: 14.4 V
• Supply Current: 40 mA
• Maximum Power Dissipation: 25000 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 4 Ohms
• Input Signal Type: Differential or Single
• Minimum Operating Temperature: - 55 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 17.5 V
• Supply Voltage (min): 6 V
• Output Type: 1-Channel Mono or 2-Channel Stereo
• Package / Case: SOT-131-2
• Other names: TDA1519C/N3,112

NXP Semiconductors
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
2004 Jan 28
22 W BTL or 2  11 W
stereo power amplifier
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
19
Product specification
TDA1519C